FDS6690A Fairchild Semiconductor, FDS6690A Datasheet - Page 2

• Manufacturer Part Number: FDS6690A
• Description: MOSFET N-CH 30V 11A 8-SOIC
• Manufacturer: Fairchild Semiconductor
• Series: PowerTrench®r

Specifications of FDS6690A

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 12.5 mOhm @ 11A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 11A
• Vgs(th) (max) @ Id: 3V @ 250µA
• Gate Charge (qg) @ Vgs: 16nC @ 5V
• Input Capacitance (ciss) @ Vds: 1205pF @ 15V
• Power - Max: 1W
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Configuration: Single Quad Drain Triple Source
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.0125 Ohm @ 10 V
• Forward Transconductance Gfs (max / Min): 48 S
• Drain-source Breakdown Voltage: 30 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 11 A
• Power Dissipation: 2500 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FDS6690ATR

Notes:
1. R
2 Test: Pulse Width < 300µs, Duty Cycle < 2.0%
3. Starting TJ = 25°C, L = 3mH, I
Electrical Characteristics
Symbol
Off Characteristics
BV
∆BV
I
I
On Characteristics
V
∆V
R
I
g
Dynamic Characteristics
C
C
C
R
Switching Characteristics
t
t
t
t
Q
Q
Q
Drain–Source Diode Characteristics and Maximum Ratings
I
V
t
Q
the drain pins. R
DSS
GSS
D(on)
d(on)
r
d(off)
f
S
rr
FS
GS(th)
SD
θJA
∆T
∆T
DS(on)
iss
oss
rss
G
g
gs
gd
rr
DSS
GS(th)
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
DSS
J
J
θJC
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
is guaranteed by design while R
AS
Parameter
= 8A, V
(Note 2)
DD
a)
= 30V, V
(Note 2)
50°C/W when mounted
on a 1in
copper
θCA
GS
is determined by the user's board design.
2
= 10V
pad of 2 oz
T
A
V
I
V
V
V
V
I
V
V
V
V
V
V
f = 1.0 MHz
V
V
V
V
V
V
I
D
D
F
= 25°C unless otherwise noted
GS
DS
DS
GS
DS
GS
GS
GS
GS
DS
DS
GS
DD
GS
DS
GS
GS
= 11 A, d
= 250 µA, Referenced to 25°C
= 250 µA, Referenced to 25°C
= 10 V, I
= 0 V,
= 24 V,
= 24 V, V
= ±20 V,
= V
= 10 V,
= 4.5 V,
= 10 V,
= 5 V,
= 15 V,
= 15 mV, f = 1.0 MHz
= 15 V,
= 10 V,
= 15 V,
= 5 V
= 0 V,
Test Conditions
GS
,
iF
D
/d
GS
= 11 A, T
t
I
= 100 A/µs
I
V
V
D
I
I
V
I
V
I
R
I
I
= 0 V, T
D
D
D
D
D
D
S
GS
DS
DS
= 250 µA
GEN
GS
= 2.1 A
= 250 µA
= 11 A
= 10 A
= 11 A
= 1 A,
= 11 A,
= 0 V
= 0 V
= 5 V
= 0 V,
= 6 Ω
J
=125°C
J
=55°C
(Note 2)
Min Typ
30
50
1
b) 125°C/W when mounted on a
Scale 1 : 1 on letter size paper
minimum pad.
1205
12.0
13.7
0.74
290
115
1.9
9.8
2.4
3.4
4.0
25
–5
48
28
12
24
27
9
5
9
Max
±100
12.5
17.0
22.0
2.1
1.2
10
19
10
44
19
16
1
3
FDS6690A Rev E1 (W)
Units
mV/°C
mV/°C
mΩ
µA
µA
nA
pF
pF
pF
nC
nC
nC
nS
nC
ns
ns
ns
ns
Ω
V
V
A
S
A
V