AD9866BCP Analog Devices Inc, AD9866BCP Datasheet - Page 9

• Manufacturer Part Number: AD9866BCP
• Description: IC FRONT-END MIXED-SGNL 64-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9866BCP

• Rohs Status: RoHS non-compliant
• Rf Type: HPNA, VDSL
• Features: 12-bit ADC(s), 12-bit DAC(s)
• Package / Case: 64-VFQFN, CSP Exposed Pad
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3/3.135V
• Operating Supply Voltage (max): 3.6/3.465V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Package Type: LFCSP
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
ELECTRICAL
ENVIRONMENTAL
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
AVDD, CLKVDD Voltage
DVDD, DRVDD Voltage
RX+, RX−, REFT, REFB
IOUTP+, IOUTP−
IOUTN+, IOUTN−, IOUTG+,
OSCIN, XTAL
REFIO, REFADJ
Digital Input and Output Voltage
Digital Output Current
Operating Temperature Range
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
Storage Temperature Range
IOUTG−
(Ambient)
(Ambient)
Rating
3.9 V maximum
3.9 V maximum
−0.3 V to AVDD + 0.3 V
−1.5 V to AVDD + 0.3 V
−0.3 V to 7 V
−0.3 V to CLVDD + 0.3 VS
−0.3 V to AVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
5 mA maximum
−40°C to +85°C
125°C
150°C
−65°C to +150°C
Rev. A | Page 9 of 48
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance: 64-lead LFCSP (4-layer board).
θ
θ
0 LPM air).
JA
JA
= 24°C/W (paddle soldered to ground plane, 0 LPM air).
= 30.8°C/W (paddle not soldered to ground plane,
AD9866