AD9866BCP Analog Devices Inc, AD9866BCP Datasheet - Page 40

• Manufacturer Part Number: AD9866BCP
• Description: IC FRONT-END MIXED-SGNL 64-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9866BCP

• Rohs Status: RoHS non-compliant
• Rf Type: HPNA, VDSL
• Features: 12-bit ADC(s), 12-bit DAC(s)
• Package / Case: 64-VFQFN, CSP Exposed Pad
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3/3.135V
• Operating Supply Voltage (max): 3.6/3.465V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Package Type: LFCSP
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Not Compliant

AD9866
occurs within 100 ns. The user-programmable delay for the Tx
path power-down is meant to match the pipeline delay of the
last Tx burst sample such that power-down of the TxDAC and
IAMP does not impact its transmission. A 5-bit field in
Register 0x03 sets the delay from 0 to 31 TXCLK clock cycles,
with the default being 31 (0.62 µs with f
digital interpolation filter is automatically flushed with midscale
samples prior to power-down, if the clock signal into the
TXCLK pin is present for 33 additional clock cycles after TXEN
returns low. For an Rx burst, the rising edge of TXEN is used to
generate an internal signal (with no delay) that powers up the
Tx circuitry within 0.5 µs.
The Rx path power-on/power-off can be controlled by either
TXEN or RXEN by setting Bit 2 of Register 0x03. In the default
setting, the falling edge of TXEN powers up the Rx circuitry
within 2 µs, while the rising edge of TXEN powers down the Rx
circuitry within 0.5 µs. If RXEN is selected as the control signal,
then its rising edge powers up the Rx circuitry and the falling
edge powers it down. To disable the fast power-down of the Tx
and/or Rx circuitry, set Bit 1 and/or Bit 0 to 0.
POWER REDUCTION OPTIONS
The power consumption of the AD9866 can be significantly
reduced from its default setting by optimizing the power
consumption vs. performance of the various functional blocks
in the Tx and Rx signal path. On the Tx path, minimum power
consumption is realized when the TxDAC output is used directly
and its standing current, I, is reduced to as low as 1 mA. Although
a slight degradation in THD performance results at reduced
standing currents, it often remains adequate for most applica-
tions, because the op amp driver typically limits the overall
linearity performance of the Tx path. The load resistors used at
the TxDAC outputs (IOUTP+ and IOUTP−) can be increased
to generate an adequate differential voltage that can be further
amplified via a power efficient op amp based driver solution.
Figure 78 shows how the supply current for the TxDAC (Pin 43)
is reduced from 55 mA to 14 mA as the standing current is
reduced from 12.5 mA to 1.25 mA. Further Tx power savings
can be achieved by bypassing or reducing the interpolation
factor of the digital filter as shown in Figure 79.
TxCLK
= 50 MSPS). The
Rev. A | Page 40 of 48
Power consumption on the Rx path can be achieved by reduc-
ing the bias levels of the various amplifiers contained within the
RxPGA and ADC. As previously noted, the RxPGA consists of
two CPGA amplifiers and one SPGA amplifier. The bias levels
of each of these amplifiers along with the ADC can be con-
trolled via Register 0x13 as shown in Table 24. The default
setting for Register 0x13 is 0x00.
Table 24. SPI Register for RxPGA and ADC Biasing
Address (Hex)
0x07
0x13
Figure 78. Reduction in TxDAC’s Supply Current vs. Standing Current
Figure 79. Digital Supply Current Consumption vs. Input Data Rate
55
50
45
40
35
30
25
20
15
10
65
60
55
50
45
40
35
30
25
20
15
0
20
1
(DVDD = DRVDD = 3.3 V and f
4× INTERPOLATION
2
30
3
INPUT DATA RATE (MSPS)
4
1× (HALF-DUPLEX ONLY)
40
Bit
(4)
(7:5)
(4:3)
(2:0)
5
I
STANDING
6
50
7
(mA)
Description
ADC low power
CPGA bias adjust
SPGA bias adjust
ADC power bias adjust
8
OUT
2× INTERPOLATION
60
= f
9
DATA
10
/10)
70
11
12
13
80