DSPIC33FJ128GP804-H/PT Microchip Technology, DSPIC33FJ128GP804-H/PT Datasheet - Page 386

• Manufacturer Part Number: DSPIC33FJ128GP804-H/PT
• Description: 16-bit DSC, 128KB Flash, CAN, DMA, 40 MIPS, NanoWatt 44 TQFP 10x10x1mm TRAY
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP804-H/PT

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b, D/A 6x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 140°C
• Package / Case: 44-TQFP
• Processor Series: dsPIC33F
• Core: dsPIC
• Data Bus Width: 16 bit
• Interface Type: SPI, I2C, UART, JTAG
• Number Of Programmable I/os: 35
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 140 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 13
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
32.1
DS70292E-page 386
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
e
1.345
MIN
.120
.015
.290
.240
.110
.008
.040
.014
A2
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
© 2011 Microchip Technology Inc.
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
c