EMIF02-USB03F2 STMicroelectronics, EMIF02-USB03F2 Datasheet - Page 6

• Manufacturer Part Number: EMIF02-USB03F2
• Manufacturer: STMicroelectronics

Specifications of EMIF02-USB03F2

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -40C to 85C
• Product Height (mm): 0.65mm
• Product Depth (mm): 1.57mm
• Lead Free Status / RoHS Status: Compliant

Ordering information
Note:
5
6/8
Figure 13. Footprint
340 µm min. for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max.
Figure 15. Flip Chip tape and reel specification
More information is available in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Ordering information
Table 3.
EMIF02-USB03F2
Solder stencil opening:
Copper pad Diameter:
330 µm recommended
Order code
All dimensions in mm
Ordering information
0.73 ± 0.05
Marking
Dot identifying Pin A1 location
FU
Doc ID 10740 Rev 5
Package
Flip Chip
Figure 14. Marking
User direction of unreeling
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
Weight
ECOPACK status
4 ± 0.1
4 mg
(y = year
ww = week)
2.04
4 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
x
y
w
x
EMIF02-USB03F2
w
Tape and reel 7”
z
Delivery mode