EMIF02-MIC03M6 STMicroelectronics, EMIF02-MIC03M6 Datasheet
EMIF02-MIC03M6
Specifications of EMIF02-MIC03M6
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EMIF02-MIC03M6 Summary of contents
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... IEC 61000-4-2 level 4, input and output pins – (contact discharge) Application ■ Mobile phones Description The EMIF02-MIC03M6 is a 2-line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges all pins ...
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... Parameter = 25 °C) amb RM Min OSC Figure 4. 0.00 0.00 -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 3.0G EMIF02-MIC03M6 Value 8 125 - -55 to +150 Typ. ...
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... EMIF02-MIC03M6 Figure 5. ESD response to IEC 61000-4-2 (+8 kV air discharge) on MIC lines 2 Ordering information scheme Figure 7. Ordering information scheme EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads Figure V/d Input V/d Output 20 ns/d Ordering information scheme ESD response to IEC 61000-4-2 ...
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... D N Ref Figure 9. 0.25 [0.010] 0.60 [0.023] 0.30 1.60 [0.012] [0.063] EMIF02-MIC03M6 Dimensions Millimeters Min. Typ. Max. Min. A 0.50 0.55 0.60 0.020 0.022 0.024 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 D 1.45 E 1.00 e 0.50 K 0.20 ...
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... EMIF02-MIC03M6 Figure 10. Tape and reel specification Dot identifying pin 1 location All dimensions in mm Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. ...
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... Aspect Ratio Aspect Area 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 12. Recommended stencil window position 7 µm 6/ ≥ ---- - = 1.5 T × ≥ --------------------------- - = 0. µm 15 µm 236 µm 15 µm 250 µm EMIF02-MIC03M6 T W Footprint Stencil window Footprint ...
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... EMIF02-MIC03M6 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF02-MIC03M6 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max ...
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... EMIF02-MIC03M6 5 Ordering information Table 4. Ordering information Order code EMIF02-MIC03M6 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 13-Feb-2008 Marking Package (1) L Micro QFN Revision 1 Initial release Ordering information Weight Base qty Delivery mode 2 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF02-MIC03M6 ...