EMIF02-MIC02F2 STMicroelectronics, EMIF02-MIC02F2 Datasheet

IC EMI FILTER 2LINE ESD FLIPCHIP

EMIF02-MIC02F2

Manufacturer Part Number
EMIF02-MIC02F2
Description
IC EMI FILTER 2LINE ESD FLIPCHIP
Manufacturer
STMicroelectronics
Series
IPAD™r
Datasheet

Specifications of EMIF02-MIC02F2

Filter Type
Signal Line
Voltage - Rated
12V
Mounting Type
Surface Mount
Termination Style
Surface Mount (SMD,SMT)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Inductance
-
Other names
497-3782-2

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EMIF02-MIC02F2
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Features
Complies with the following standards
Applications
Where EMI filtering in ESD sensitive equipment is
required:
Description
The EMIF02-MIC02 is a highly integrated devices
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF02 Flip Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15 kV.
April 2008
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
1.42 mm x 0.92 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging
IEC 61000-4-2 level 4 on input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-2 level 1 on input pins
– 2 kV (air discharge)
– 2 kV (contact discharge)
Mobile phones and communication systems
Computers, printers and MCU Boards
2-line IPAD™, EMI filter and ESD protection
Rev 3
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Input
GND
O2
Pin configuration (bump side)
Basic cell configuration
3
I2
EMIF02-MIC02F2
Low-pass Filter
GND
(6 bumps)
Flip Chip
GND
GND
2
O1
GND
1
I1
Output
A
B
Ri/o = 470
Cline = 16 pF
www.st.com
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EMIF02-MIC02F2 Summary of contents

Page 1

... This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15 kV. April 2008 2-line IPAD™, EMI filter and ESD protection Figure 1. Figure 2. Input GND TM: IPAD is a trademark of STMicroelectronics. Rev 3 EMIF02-MIC02F2 Flip Chip (6 bumps) Pin configuration (bump side GND ...

Page 2

... I Peak pulse current PP Series resistance between input and R I/O output C Input capacitance per line line Symbol I line 2 °C) amb Parameter = 25 °C) amb Parameters RM Test conditions = 12 V per line EMIF02-MIC02F2 Value 125 -40 to +85 -55 to 150 Min Typ Max 14 16 500 423 ...

Page 3

... EMIF02-MIC02F2 Figure 3. S21 (dB) attenuation measurement and Aplac simulation - 10. 15.00 - 20.00 - 25.00 - 30.00 - 35.00 - 40.00 - 45.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz Figure 5. Digital crosstalk measurement Figure 7. ESD response to IEC61000-4-2 (+15 kV air discharge) on one input V(in) and on one output (Vout) Figure 4 ...

Page 4

... IKF = 1000 IKF = 1000 IS = 10f IS = 10f ISR = 100p ISR = 100p 0.3333 M = 0.3333 RS = Rs_int RS = Rs_gnd 50n TT = 50n EMIF02-MIC02F2 gnd 50pH 50m Lgnd Cgnd Cgnd Rgnd Ls 400pH Rs 100m R_470R 482.6 Cz_ext 8.73pF Rs_ext 850m Cz_int 2.9pF Rs_int 850m Cz_gnd 215.61pF Rs_gnd 470m ...

Page 5

... EMIF02-MIC02F2 3 Ordering information scheme Figure 11. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / letters = application 2 digits = version Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...

Page 6

... AN1751: “EMI filters: Recommendations and measurements” 6/8 Figure 14. Marking Dot identifying Pin A1 location 0.73 ± 0.05 User direction of unreeling All dimensions in mm Marking Package FJ Flip Chip EMIF02-MIC02F2 Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week Ø 1.5 ± 0.1 4 ± ...

Page 7

... EMIF02-MIC02F2 6 Revision history Table 4. Document revision history Date 12-Oct-2004 11-Jan-2006 17-Apr-2008 Revision 1 Initial release. ECOPACK statement added. Die dimensions modified in 2 and first page. Typographical errors corrected. Updated ECOPACK statement. Updated 3 Figure 15. Reformatted to current standards. Revision history Changes Figure 12. Figure 11, ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF02-MIC02F2 ...

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