EMIF02-USB02F2 STMicroelectronics, EMIF02-USB02F2 Datasheet
EMIF02-USB02F2
Specifications of EMIF02-USB02F2
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EMIF02-USB02F2 Summary of contents
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... MIL STD 883E - Method 3015-6 Class 3 Application EMI filtering and ESD protection for USB port. Description The EMIF02-USB02F2 is a highly integrated array designed to suppress EMI / RFI noise for a USB port. The EMIF02-USB02F2 Flip Chip packaging means the package size is equal to the die size. ...
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... C Input capacitance per line line Symbol line R ,R Tolerance ± Tolerance ± Tolerance ± (D1 diode °C) amb Parameter and test conditions = 25 °C) amb Parameter RM V Test conditions EMIF02-USB02F2 Value 15 8 125 - 150 Min. Typ. Max. 6 0 Unit kV ° ...
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... EMIF02-USB02F2 Figure 3. Attenuation measurement 0. 5.00 - 10.00 - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 - 40.00 - 45.00 - 50.00 100.0k 1.0M 10.0M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15kV contact discharge) Figure 4. 0. 10.00 - 20.00 - 30.00 - 40.00 - 50.00 - 60.00 - 70.00 - 80.00 - 90.00 100.0M 1.0G 100.0k Figure 6. ...
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... Cz 17pF opt D02_usb diodes model Ls 0.4nH + 0.1 + IBV = 1m Rsub_D 10 + CJO = Cz Csub 0.3pF + M = 0.3333 Rsub_33R Rsub_1k3 0.6 lhole 170pH opt + TT = 100n Cbump 1.2pF opt Rbump 350 EMIF02-USB02F2 Cbump Rbump + I/O bulk 100m D2 bulk D02_5p diodes model + BV = 100 + IBV = 1m + CJO = 0.3333 + 0 100n ...
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... EMIF02-USB02F2 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... User direction of unreeling Marking Package FG Flip Chip Revision 1 First issue Updated ECOPACK statement. Updated 2 Figure 12, and Figure EMIF02-USB02F2 Ø 1.5 ± 0.1 4 ± 0.1 2.07 4 ± 0.1 Weight Base qty Delivery mode 4.25 mg 5000 Tape and reel 7” Changes Figure 9, Figure 13 ...
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... EMIF02-USB02F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...