EMIF02-USB05C2 STMicroelectronics, EMIF02-USB05C2 Datasheet
EMIF02-USB05C2
Specifications of EMIF02-USB05C2
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EMIF02-USB05C2 Summary of contents
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... Mobile phones and communication systems ■ Computers, printers and MCU boards Description The EMIF02-USB05C2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB05C2 Flip- Chip packaging means the package size is equal to the die size. ...
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... C Input capacitance per line line Symbol line Matching 2/7 Parameter and test conditions = 25° C) amb Parameter RM Test conditions Tolerance per line ± ± Serial resistance matching EMIF02-USB05C2 Value Unit 125 ° ° 150 ° Min. Typ. Max. Unit µA 33 1.5 kΩ ...
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... EMIF02-USB05C2 Figure 1. S21 (dB) attenuation measurement Figure 2. dB 0.00 - -10. -20.00 - -30. (Hz) - -40. 100.0k 1.0M 10.0M Figure 3. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (Vin) and on one output (Vout) V(in) 5 V/d V(out) 5 V/d 100 ns/d Figure 5. Junction capacitance versus reverse voltage applied ...
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... Cz_D1 15pF M=0.3333 aplacvar Rs_D1 1 RS=Rs_d1 aplacvar Cz_D2 300pF VJ=0.6 aplacvar Rs_D2 0.3 TT=100n aplacvar Lgnd 100pH aplacvar Rgnd 100m aplacvar Cgnd 0.4pF aplacvar Lbump 50pH aplacvar Rbump 20m EMIF EMIF02-USB05C2 bulk D2 A2 MODEL Rbump Rbump D1 Lbump Lbump Lbump Rbump = ...
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... EMIF02-USB05C2 3 Package information Figure 8. Flip-Chip package dimensions Figure 9. Foot print recomendations Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter Figure 11. Flip-Chip tape and reel specification All dimensions in mm 315 µ ...
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... EMIF02-USB05C2 5 Revision history Date 14-Mar-2005 13-Nov-2006 6/7 Marking Package GV Flip-Chip Revision 1 Initial release. Reformatted to current standards. Modified functional diagram on 2 page 1 to show connections. Updated Aplac model information. EMIF02-USB05C2 Weight Base qty Delivery mode 2.7 mg 5000 Tape and reel 7” Changes ...
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... EMIF02-USB05C2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...