EMIF02-USB03F2 STMicroelectronics, EMIF02-USB03F2 Datasheet

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EMIF02-USB03F2

Manufacturer Part Number
EMIF02-USB03F2
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of EMIF02-USB03F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Product Depth (mm)
1.57mm
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EMIF02-USB03F2
Manufacturer:
ST
0
Part Number:
EMIF02-USB03F2
Quantity:
300
Features
Complies with the following standards
Application
ESD protection and EMI filtering for:
Description
The EMIF02-USB03F2 is a highly integrated array
designed to suppress EMI / RFI noise for USB
OTG (on-the-go) ports.
The EMIF02-USB03F2 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to 15 kV
on external contacts.
February 2010
2-line, low-pass filter + 2-line ESD protection
High efficiency in EMI filtering
Lead-free package
Very low PCB space occupation: < 2.80 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
IEC 61000-4-2 level 4 on external pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
IEC 61000-4-2 level 1 on internal pins:
– 2 kV (air discharge)
– 2 kV (contact discharge)
USB OTG port
2-line IPAD™, EMI filter including ESD protection
Doc ID 10740 Rev 5
2
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
D+OUT
D-OUT
Pd2
Pd1
EMIF02-USB03F2
Pin layout (bump side)
Schematic
EMIF02-USB03F2
Vbus
out
out
D+
D-
3
ID
R2=33Ω
R1=33Ω
R5=15kΩ
(11 bumps)
C LINE = 20 pF max.
Flip Chip
GND
Pup
Pd2
Dz
2
R4=17kΩ
Pup
R3=1.3kΩ
Pd1
D+
D-
in
in
1
A
B
C
D
Dz
ID
Vbus
www.st.com
D+IN
D-IN
1/8
8

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EMIF02-USB03F2 Summary of contents

Page 1

... Application ESD protection and EMI filtering for: ■ USB OTG port Description The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports. The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection ...

Page 2

... R Tolerance ± Tolerance ± Tolerance ± Tolerance ± 2 °C) amb Parameter and test conditions = 25 °C) amb Parameters RM Test conditions = mV MHz, OSC Doc ID 10740 Rev 5 EMIF02-USB03F2 Value 125 -40 to +85 -55 to 150 Min Typ Max Unit Unit kV °C °C °C V µA pF Ω ...

Page 3

... EMIF02-USB03F2 Figure 3. Filtering measurement dB 0 -10 -20 -30 F (Hz) -40 100k 1M 10M D+In D+Out D-In D-Out Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input V and on one output Div 10 Div OUT Figure 7. Junction capacitance versus reverse voltage applied (typical values Figure 4. ...

Page 4

... Cbump Cbump Rsubump Rsubump Rsubump Cbump Rsubump Cbump Cbump Rsubump Rsubump bulk bulk 950pH Rs 150m R_33R 33 R_1k3 1.3k R_15k 15k R_17k 17k Cz_usb03 11pF Rs_usb03 1 Cz_usb03_gnd 220pF Doc ID 10740 Rev 5 EMIF02-USB03F2 Vbus Vbus D+IN D+ D-IN D- GND Lbump Lbump Port2 Port2 MODEL = D02_usb03_gnd ...

Page 5

... EMIF02-USB03F2 3 Ordering information scheme Figure 11. Ordering information scheme EMI Filter Number of lines Information x = resistance value (ohm capacitance value / 10 (pF letters = application 2 digits = version Package F = Flip Chip lead-free, pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ...

Page 6

... Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode Dot identifying Pin A1 location 4 ± 0.1 User direction of unreeling Marking Package Weight FU Flip Chip 4 mg Doc ID 10740 Rev 5 EMIF02-USB03F2 (y = year ww = week Ø 1.5 ± 0.1 2.04 4 ± 0.1 Base qty Delivery mode 5000 ...

Page 7

... EMIF02-USB03F2 6 Revision history Table 4. Document revision history Date Revision 14-Oct-2004 25-Oct-2004 27-Oct-2004 28-Apr-2008 08-Feb-2010 1 Initial release. 2 Figure 14.: Flip Chip marking dimensions updated. 3 Minor layout update. No content change. Updated ECOPACK statement. Updated 4 Figure 14 and Figure 15. Reformatted to current standards. Updated the maximum value of I ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 10740 Rev 5 EMIF02-USB03F2 ...

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