H27UF081G1M-TPCB HYNIX SEMICONDUCTOR, H27UF081G1M-TPCB Datasheet - Page 9

IC, MEMORY, FLASH NAND 1GB, TSOP48

H27UF081G1M-TPCB

Manufacturer Part Number
H27UF081G1M-TPCB
Description
IC, MEMORY, FLASH NAND 1GB, TSOP48
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet

Specifications of H27UF081G1M-TPCB

Access Time
45ns
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Base Number
27
Interface
Serial
Logic
RoHS Compliant
Package / Case
TSOP
Memory Type
Flash - NAND
Memory Configuration
128M X 8
Rohs Compliant
Yes
Memory Size
1Gbit
Rev 0.2 / May. 2007
NOTE:
1. With the CE don’t care option CE high during latency time does not stop the read operation
CLE
H
H
X
X
X
X
L
L
L
L
L
ALE
H
H
L
L
L
L
L
X
X
X
X
L
CE
H
(1)
X
X
X
L
L
L
L
L
L
Rising
Rising
Rising
Rising
Rising
WE
H
H
X
X
X
X
Table 6: Mode Selection
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
Falling
RE
H
H
H
H
H
H
X
X
X
X
0V/Vcc
WP
X
X
H
H
H
X
X
H
H
L
HY27US(08/16)1G1M Series
Read Mode
Write Mode
Data Input
Sequential Read and Data Output
During Read (Busy)
During Program (Busy)
During Erase (Busy)
Write Protect
Stand By
Command Input
Address Input(4 cycles)
Command Input
Address Input(4 cycles)
MODE
Preliminary
9

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