CB-ACC-53 ConnectBlue, CB-ACC-53 Datasheet - Page 36

• Manufacturer Part Number: CB-ACC-53
• Description: ANTENNA DUAL-BAND RPSMA
• Manufacturer: ConnectBlue

Specifications of CB-ACC-53

• Antenna Type: Whip: 1/2 Wave, Swivel, Tilt (Right Angle)
• Number Of Bands: 2
• Frequency: 2.4GHz, 5GHz
• Gain: 3dBi
• Termination: RP-SMA
• Mounting Type: Connector
• Height (max): 4.21" (107mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 809-1035

5.3 Using Press-Fit Nuts for Mounting the Module
A press-fit nut is pressed into the PCB from the bottom side with a special press tool. M2 sized
press-fit nuts are suitable for the modules (see Figure 7 and Figure 8) and are manufactured by
PEM Fastening Systems (www.pemnet.com), part no KFS2-M2 (see Figure 9). Be careful with
the distance between the nuts regarding alignment, see section 5.1.2.
Figure 9: KFS2-M2 press-fit nut.
Spacer-pipes are recommended to use between the PCBs when press-fit nuts are used.
5.4 Using the J6 PCB solder pads on the edge
5.4.1 Host PCB
The host PCB footprint should not contain any traces or vias under the module except the pads
interfacing the J6 pads to avoid contact with traces/vias on the module. The host pads which
are soldered to the J6 pads should reach 0.5-1.0mm under the PCB and some mm outside the
module. No other pads than the J6 should be soldered to the host PCB. See section 2.1.1 for
more info about the J6 pads.
5.4.2 Mounting process
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We strongly recommend the modules not being soldered more than 1 time after ship-
ping from connectBlue and that the modules are mounted just before the host product
is being soldered the last time. Although, connectBlue devices will withstand up to two
reflows to an absolute maximum temperature of 250°C.
The PCB in our modules is made of FR4-type with Chemical Gold Pads.
The modules are produced in a lead-free process with a lead-free soldering paste.
It is recommended that the customers make their own electrical, climate, stress and vi-
bration tests on the final assembled product to secure that the manufacturing process
hasn't damaged or affected the Bluetooth module in any way.
The modules can be delivered on trays or individually packed in ESD bags with label on
each module. The label will not withstand the heat of soldering and should be removed
before processed. The modules delivered in trays will not have individual label (only
batch labels on the tray).
Modules delivered on trays are classed with MSL-Class 3.
The device recommended maximum reflow temperature is 245°C for 10 sec.
The device absolute maximum reflow temperature is 250°C for 3 sec.
Version 1.16 - 2009-12
36