PBSS4021SPN,115 NXP Semiconductors, PBSS4021SPN,115 Datasheet
PBSS4021SPN,115
Specifications of PBSS4021SPN,115
PBSS4021SPN,115
Related parts for PBSS4021SPN,115
PBSS4021SPN,115 Summary of contents
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PBSS4021SP 20 V, 6.3 A PNP/PNP low V Rev. 2 — 11 October 2010 1. Product profile 1.1 General description PNP/PNP low V medium power Surface-Mounted Device (SMD) plastic package. Table 1. Type number PBSS4021SP 1.2 Features and benefits Low ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PBSS4021SP 4. Marking Table 5. Type number PBSS4021SP 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot PBSS4021SP Product data sheet ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per transistor R th(j-a) R th(j-sp) Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on a ceramic PCB, Al ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. −1 10 −5 − FR4 PCB, mounting pad for collector 1 cm Fig 3. Per transistor: Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 2 10 duty cycle = 1 ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol Parameter Per transistor I CBO I CES I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS4021SP Product data sheet 20 V, 6.3 A PNP/PNP low V Characteristics ° C unless otherwise specified. Conditions = − collector-base V CB cut-off current = − 150 °C ...
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... NXP Semiconductors 600 ( (2) 400 (3) 200 0 −1 −10 −1 −10 − − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. DC current gain as a function of collector current; typical values −1 (V) −1.0 (1) −0.6 (2) (3) −0.2 −1 −10 −1 −10 − ...
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... NXP Semiconductors −1 V CEsat (V) −1 −10 −2 −10 −3 −10 −1 −10 −1 −10 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values CEsat (Ω −1 10 −2 10 −1 − ...
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... NXP Semiconductors 8. Test information − − Fig 13. BISS transistor switching time definition Fig 14. Test circuit for switching times PBSS4021SP Product data sheet 20 V, 6.3 A PNP/PNP low (probe) oscilloscope 450 Ω −12 − −0. Bon All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 9. Package outline Fig 15. Package outline SOT96-1 (SO8) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBSS4021SP [1] For further information and the availability of packing methods, see PBSS4021SP Product data sheet 20 V, 6.3 A PNP/PNP low V 5 ...
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... NXP Semiconductors 11. Soldering Fig 16. Reflow soldering footprint SOT96-1 (SO8) Fig 17. Wave soldering footprint SOT96-1 (SO8) PBSS4021SP Product data sheet 20 V, 6.3 A PNP/PNP low V 5.50 0.60 (8×) solder lands placement accuracy ± 0.25 occupied area 1.20 (2×) 0.60 (6×) 0.3 (2×) 1.27 (6×) 5 ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PBSS4021SP v.2 20101011 • Modifications: Figure 1 “Per device: Power derating PBSS4021SP v.1 20100714 PBSS4021SP Product data sheet 20 V, 6.3 A PNP/PNP low V Data sheet status Product data sheet curves”: updated. Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 11 Soldering ...