OM6271 NXP Semiconductors, OM6271 Datasheet - Page 27

Interface Modules & Development Tools SPI to I2C Master Bridge Demoboard

OM6271

Manufacturer Part Number
OM6271
Description
Interface Modules & Development Tools SPI to I2C Master Bridge Demoboard
Manufacturer
NXP Semiconductors
Datasheet

Specifications of OM6271

Interface Type
I2C, SPI
Data Bus Width
8 bit
For Use With/related Products
SC18IS601IPW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
12. Abbreviations
SC18IS600_601_5
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 17.
Acronym
ASCII
CPU
GPIO
I/O
I
LSB
MSB
PCB
SPI
UART
2
Fig 30. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
American Standard Code for Information Interchange
Central Processing Unit
General Purpose Input/Output
Input/Output
Inter-Integrated Circuit bus
Least Significant Bit
Most Significant Bit
Printed-Circuit Board
Serial Peripheral Interface
Universal Asynchronous Receiver/Transmitter
Rev. 05 — 28 July 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SC18IS600/601
temperature
SPI to I
peak
© NXP B.V. 2008. All rights reserved.
2
C-bus interface
001aac844
time
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