OM6271 NXP Semiconductors, OM6271 Datasheet - Page 23

Interface Modules & Development Tools SPI to I2C Master Bridge Demoboard

OM6271

Manufacturer Part Number
OM6271
Description
Interface Modules & Development Tools SPI to I2C Master Bridge Demoboard
Manufacturer
NXP Semiconductors
Datasheet

Specifications of OM6271

Interface Type
I2C, SPI
Data Bus Width
8 bit
For Use With/related Products
SC18IS601IPW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
10. Package outline
Fig 28. Package outline SOT403-1 (TSSOP16)
SC18IS600_601_5
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
(1)
Rev. 05 — 28 July 2008
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
SC18IS600/601
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
SPI to I
0.13
3
w
X
v
0.1
A
© NXP B.V. 2008. All rights reserved.
y
M
2
C-bus interface
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
o
o
23 of 30

Related parts for OM6271