APTGF50DH60T1G Microsemi Power Products Group, APTGF50DH60T1G Datasheet - Page 3
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APTGF50DH60T1G
Manufacturer Part Number
APTGF50DH60T1G
Description
IGBT NPT BRIDGE 600V 65A SP1
Manufacturer
Microsemi Power Products Group
Datasheet
1.APTGF50DH60T1G.pdf
(7 pages)
Specifications of APTGF50DH60T1G
Igbt Type
NPT
Configuration
Asymmetrical Bridge
Voltage - Collector Emitter Breakdown (max)
600V
Vce(on) (max) @ Vge, Ic
2.45V @ 15V, 50A
Current - Collector (ic) (max)
65A
Current - Collector Cutoff (max)
250µA
Input Capacitance (cies) @ Vce
2.2nF @ 25V
Power - Max
250W
Input
Standard
Ntc Thermistor
Yes
Mounting Type
Chassis Mount
Package / Case
SP1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal and package characteristics
Temperature sensor NTC
Symbol Characteristic
Torque
Symbol
∆R
SP1 Package outline
V
R
T
B
∆B/B
Wt
T
T
ISOL
R
STG
thJC
25
25/85
C
J
25
/R
25
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Characteristic
Resistance @ 25°C
T
25
= 298.15 K
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com
(dimensions in mm)
R
T
=
exp
(see application note APT0406 on www.microsemi.com for more information).
⎡
⎢
⎣
B
25
/
85
R
⎛
⎜ ⎜
⎝
25
T
1
25
−
T
1
⎞
⎟ ⎟
⎠
www.microsemi.com
⎤
⎥
⎦
T: Thermistor temperature
R
T
: Thermistor value at T
To heatsink
APTGF50DH60T1G
T
IGBT
Diode
C
=100°C
M4
2500
Min
Min
-40
-40
-40
2.5
3952
Typ
Typ
50
5
4
Max
Max
125
150
100
0.5
1.2
4.7
80
°C/W
Unit
Unit
N.m
kΩ
°C
%
%
K
V
g
3 – 7