AT88RF1354-ZU Atmel, AT88RF1354-ZU Datasheet

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... Industrial Operating Temperature: -40° to +85° C Description The AT88RF1354 is a smart, high performance ISO/IEC 14443 Type B RF Reader IC. The AT88RF1354 communicates with RFID Transponders or Contactless Smartcards using the industry standard ISO/IEC 14443-2 Type B signal modulation scheme and ISO/IEC 14443-3 Type B frame format. Data is exchanged half duplex at a 106k bit per second rate ...

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Introduction 1.1. Block Diagram Figure 1. Block Diagram RFin Modulator C6 ANT ANT Driver Vss_ANT PLL CLKO 13.56 MHz Type B RF Reader Specification 2 Filter Transmit Command Response 13.56 MHz Xtal1 Xtal2 ResetB ISEL Receive SRAM and Logic ...

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... Reference Designs and additional technical information is available in AT88RF1354 Application Notes. The reference designs described in the AT88RF1354 Application Notes include schematics, board designs, and a complete bill of materials. Each reference design has been optimized for reliable, robust communications with cards and tags with antenna dimensions within a specified size range ...

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... Type B standard frame and transmitted on the RF communications channel, along with the CRC. When a response is received from the card, the response frame is decoded by AT88RF1354 and the resulting bytes are stored in SRAM buffer memory CRC or frame format error is detected in the response, then bits are set in the Error Register (EREG) ...

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... All other commands will timeout if no response is received usually not necessary to use the Abort Command to interrupt them. The Clear Command is used to clear the configuration registers and place AT88RF1354 in a known initial state. The Clear Command is usually the first command sent after the reader is powered on and reset. ...

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... Register Summary The AT88RF1354 Command Reference Guide document contains all of the detailed information required by a software developer or embedded systems programmer to use the AT88RF1354 Register Set. See AT88RF1354 Command Reference Guide (doc 5150x). Table 2. Register set sorted by address. Register Register Name Address ...

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... Communications Protocol Registers AT88RF1354 contains five 16 bit Communication Protocol Registers for configuration of the RF communication protocol. Each register contains a high byte (CPRx_H) and a low byte (CPRx_L). The CPRx_H registers are used to configure the Frame Wait Time. The CPRx_L registers are currently unused (Reserved for Future Use) and must remain set to $00 ...

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... Status Registers AT88RF1354 contains three read-only registers that provide status information. The operational status of the IC is contained in the SREG Register; by reading this register it can be determined if the RF Field is on and if the analog circuits are fully powered up. The RF communication errors flags are stored in EREG; these flags are also returned in the response of RF communication commands. The IDR Register contains the hardware ID revision of the die ...

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Pin List Pin Name 1 V _ANT _ANT SS 3 ANT 4 Xtal1 5 Xtal2 Test1 8 CLKO 9 ResetB 10 ISEL 11 TestD 12 Istat 13 SSB 14 SCK 15 SDI 16 ...

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Power and Ground Pin Descriptions 4.1.1. V [24] CC Supply Voltage for I/O buffers, digital, and analog circuits. V since all digital I/O levels are referenced to V Two V bypass capacitors must be connected between the V CC ...

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... A low level on Istat indicates that the serial interface buffer is empty. Note: Use of Istat for serial communications control is mandatory, and the AT88RF1354 will not accept commands from the host microcontroller when Istat is high. 4.2.5. ResetB [9] Reset Bar input pin ...

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... C6 Antenna bypass capacitor pin. The C6 pin provides power to the antenna circuits and modulates the power level for communications. 4.3.3. RFin [32] RF input pin. RFin is the input to the receiver. A resistor/capacitor filter is used to limit the peak to peak voltage on this pin to a safe level. See the AT88RF1354 reference design for appropriate component values. 4.4. Analog Pin Descriptions 4.4.1. C1 [21] C1 bypass capacitor pin ...

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C7 [29] C7 bypass capacitor pin. Bypass capacitance for the analog circuits must be connected between the C7 pin and V A. This capacitor must be placed within the package. Any 47 nF ...

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Typical Application 5.1. Operating Principle Contactless RF smart cards operating at 13.56 Mhz are powered by and communicate with the reader via inductive coupling of the reader antenna to the card antenna. The two loop antennas effectively form a ...

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... Application In a typical application the AT88RF1354 reader circuitry and the loop antenna are integrated on a single four layer printed circuit board. The host microcontroller and power supply may reside on the same PCB separate PCB depending on the application requirements. The passive components required for the reader IC to function are placed in a small area immediately surrounding the QFN package for optimum RF circuit performance ...

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... permanently damaged. 4. AT88RF1354 does not support hot swapping or hot plugging. Connecting or disconnecting this device to a system while power is energized can cause permanent damage to AT88RF1354. 13.56 MHz Type B RF Reader Specification 16 * Notice: ) ...................... 6.0 Volts CC _ANT) ............ 6.0 Volts ...

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... Typical values at 25° C. Maximum values are characterized values and not test limits in production performance is dependent on the reader circuit design, PCB layout, and component specifications. RF timing values in table are measured on an Atmel reference design. 3. This parameter is not tested. Values are based on characterization and/or simulation data. ...

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TWI Mode Timing T = -40° to +85° 3 4.5 to 5.5 V (unless otherwise noted Symbol Parameter t SCK High pulse width HIGH t SCK Low pulse width LOW ...

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... Typical values at 25° C. Values are based on characterization and are not tested. 2. Operating Frequency is dependent on the reader circuit design, PCB layout, and component specifications. An Atmel reference design with 13.560 MHz 50 ppm crystal was used to characterize this parameter. 8547B–RFID–3/09 13.56 MHz Type B RF Reader Specification ...

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... Typical Characteristics The performance of AT88RF1354 is dependent on the reader circuit, the loop antenna design, the board layout, the specifications of the passive components, the quality of the supply voltages, the quality of the ground, the electrical noise in the system, and how the reader circuit is connected to the other system components. The specifications that are affected by these factors are included in this section as typical characteristics since they cannot be guaranteed in all situations ...

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... An Atmel reference design with 13.560 MHz 50 ppm crystal was used to characterize this parameter. 4. Modulation Index is determined by the ML bit setting in the TXC register. 5. Unmodulated Magnetic Field strength is different for each reader antenna and reader board design. See AT88RF1354 Application Notes. 7.3.2. Receiver Characteristics T = -40° ...

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... Mechanical 8.1. Thermal Characteristics The AT88RF1354 QFN package thermal characteristics were modeled and characterized by Amkor with JEDEC standard methods using a multilayer JEDEC test board with nine thermal vias on the PCB thermal pad. °C/W and θ is 30.9 °C/W for this package. JA ψ ...

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Package Drawing 8547B–RFID–3/09 13.56 MHz Type B RF Reader Specification 23 ...

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... AT88RF1354-ZU-T 36 pin QFN thermal package mm, Green (exceeds RoHS), Tape & Reel 9.1. Sample Ordering Information AT88RF1354 samples are available in the pin QFN package. Ordering Code AT88RF1354-ZU 36 pin QFN thermal package mm, Green (exceeds RoHS) 13.56 MHz Type B RF Reader Specification 24 Package Package Temperature Range Industrial (-40° ...

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... A.1. RF Signal Interface The AT88RF1354 RF communications interface is compliant with the ISO/IEC 14443 part 2 and part 3 Type B signaling requirements when used exactly as described in the AT88RF1354 reference design application notes. signaling utilizes amplitude modulation of the RF field for communication from the reader to the card with NRZ encoded data ...

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Figure A-2. Start of Frame (SOF) and End of Frame (EOF) format requirement Start of Frame End of Frame Last Byte A.4. Reader Data Transmission The unmodulated 13.56 Mhz carrier signal amplitude which is transmitted when the reader is idle ...

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When the subcarrier is turned on it remains unmodulated for a time period known as the synchronization time (TR1). The phase of the subcarrier during TR1 defines a logical one and permits the reader demodulator to lock on to the ...

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... PICC, the AT88RF1354 reader automatically computes the CRC on the incoming command, data, and CRC bytes. When transmitting data the AT88RF1354 reader automatically computes the CRC on the outgoing data packet, and inserts it prior to the end of frame. Any CRC error detected by AT88RF1354 is reported to the host microcontroller. ...

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ID-1 is less than the limits specified in the standard. For tags with antennas smaller than ID-1 size, a higher magnetic field strength is required. The field strength required is inversely proportional to the area ...

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... AT88RF1354 in SPI mode. The ISTAT signal is used for handshaking between the microcontroller and RF reader. B.1. SPI Interface The AT88RF1354 SPI interface operates as a slave device in SPI mode 0. In SPI mode 0 the polarity and phase of the serial clock in relation to the data is as follows: SCK is low when IDLE. ...

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... ISTAT will remain high until the last bit of the byte is read, when it will return low. Data on the SDA / SDI line is sampled by the receiving device when the SCK clock is high. Data is allowed to be changed by the transmitting device only when the SCK clock is low. All data must be clocked out of the AT88RF1354 before it can receive a command. ...

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... CC The AT88RF1354 device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation. The device address word consists bit address followed by a read/write select bit. The write bit should be set when sending command packets to AT88RF1354. The read bit should be set when retrieving response packets from AT88RF1354 ...

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... This appendix provides the guidelines for this purpose. It should be emphasized that this is just a guideline to help the user in developing the proper board design and surface mount process. Actual studies as well as development effort maybe needed to optimize the process as per user's surface mount practices and requirements. Figure D-1. AT88RF1354 6x6 mm QFN package ...

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... PCB layers on AT88RF1354 readers. D.3.3. Solder Masking Consideration The pads on the printed circuit board are either solder mask defined (SMD) or non solder mask defined (NSMD). Since the copper etching process has tighter control than the solder masking process, NSMD pads are preferred over SMD pads ...

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... Since the surface mount process varies from company to company, careful process development is recommended. The following provides some guidelines for the stencil design based on Atmel’s experience in the surface mounting of QFN packages. D.4.1. Stencil Design for Perimeter Pads Optimum and reliable solder joints on the perimeter pads should have about microns ( mils) standoff height and a good side fillet on the outside ...

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D.4.2. Stencil Design for Thermal Pad In order to effectively remove the heat from the package and to enhance the electrical performance, the die paddle needs to be soldered to the PCB thermal pad, preferably with minimum voids. However, eliminating ...

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... This protrusion is a function of the PCB thickness, the amount of paste coverage in the thermal pad region, and the surface finish of the PCB. Atmel’s experience is that this protrusion can be avoided by using a lower volume of the solder paste and reduced reflow peak temperature ...

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D.4.4. Stencil Thickness and Solder Paste A stencil thickness of 0.125 mm is recommended for 0.4 and 0.5 mm pitch parts. A laser-cut, stainless steel stencil is recommended with electro-polished trapezoidal walls to improve the paste release. Since not enough ...

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The fillet formation is also a function of the PCB land size, the printed solder volume, and the package standoff height. Since there is only limited solder available, higher standoff (controlled by the paste coverage on the thermal pad) may ...

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... Typical reflow profiles for no-clean solder paste are shown in Figure D-9. Since the actual reflow profile depends on the solder paste being used and the board density, Atmel does not recommend a specific profile. However, the temperature should not exceed the maximum temperature the package is qualified for according to the moisture sensitivity level. The time above the liquidus temperature should be around 60 seconds and the ramp rate during preheat should be 3 ° ...

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Figure D-9. Typical PCB mounting process flow. Solder Paste Printing Post Print Inspection Component Placement Pre Reflow Inspection D.6. Rework Guidelines Since solder joints are not fully exposed in the case of QFNs, any retouch is limited to the side ...

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... D.7. Summary Successful use of the AT88RF1354 QFN package requires careful development of the PCB and the manufacturing process. This appendix contains guidelines to assist the design and manufacturing engineers in optimizing the PC board and processes. These guidelines include: ─ ...

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... Frame Waiting Time. Maximum time the PCD must wait for a PICC response. H Magnetic field. Hg Mercury. Hmin Minimum unmodulated operating magnetic field strength. Hmax Maximum unmodulated operating magnetic field strength. Host The microcontroller connected to the AT88RF1354 serial interface. I Current. IC Integrated Circuit. ID Identification. IEC International Electrotechnical Commission. www.iec.ch ISO International Organization for Standardization ...

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... QFN Surface mount package style. R Random number selected by PICC during anticollision. RAM Random Access Memory. Volatile memory. Reader The AT88RF1354 with antenna and associated circuitry. RF Radio Frequency. RFU Reserved for Future Use. Any feature or bit reserved by ISO or by Atmel. rms Root Mean Square. ...

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... Appendix F. Standards and Reference Documents International Standards AT88RF1354 is designed to comply with the applicable requirements of the following ISO/IEC standards for Type B PCDs operating at the standard 106 kbps data rate. ISO/IEC 10373-6:2001 Identification Cards – Test Methods – Part 6: Proximity Cards ISO/IEC 14443-2:2001 Identification Cards – Contactless Integrated Circuit(s) Cards – Proximity Cards – Part 2: Radio Frequency Power and Signal Interface ISO/IEC 14443-3:2001 Identification Cards – ...

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... The SDO pin does not tri-state when SSB is high or when ISEL is low. This causes bus contention in SPI systems and prevents any other device from operating on an SPI bus which is connected to ATD88RF1354. Does not meet the 2000 V minimum HBM ESD requirement. G.2. AT88RF1354 with IDR Hardware Revision Register: $11 No errata. 13.56 MHz Type B RF Reader Specification 46 ...

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Appendix H. Revision History Table 6. Revision History Doc. Rev. Date 8547B 03/2009 8547A 09/2008 8547B–RFID–3/09 13.56 MHz Type B RF Reader Specification Update sections 8, 9, 10, 11, Appendix B, and Appendix G. Initial document release. Comments 47 ...

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... POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © ...