RMPA2259 Fairchild Semiconductor, RMPA2259 Datasheet - Page 9

• Manufacturer Part Number: RMPA2259
• Description: IC MOD RF POWER AMP 10PIN 4X4LCC
• Manufacturer: Fairchild Semiconductor

Specifications of RMPA2259

• Current - Supply: 50mA
• Frequency: 1.92GHz ~ 1.98GHz
• Gain: 24dB
• Noise Figure: 3dB
• Package / Case: 11-LCC
• Rf Type: W-CDMA
• Voltage - Supply: 3V ~ 4.2V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• P1db: -
• Test Frequency: -
• Other names: RMPA2259TR

©2004 Fairchild Semiconductor Corporation
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Precautions to Avoid Permanent Device Damage:
• Cleanliness: Observe proper handling procedures to
• Device Cleaning: Standard board cleaning techniques
• Static Sensitivity: Follow ESD precautions to protect
• General Handling: Handle the package on the top with a
• Device Storage: Devices are supplied in heat-sealed,
Device Usage:
Fairchild recommends the following procedures prior to
assembly.
• Dry-bake devices at 125°C for 24 hours minimum. Note:
• Assemble the dry-baked devices within 7 days of
• During the 7-day period, the devices must be stored in an
• If the 7-day period or the environmental conditions have
ensure clean devices and PCBs. Devices should remain
in their original packaging until component placement to
ensure no contamination or damage to RF, DC and
ground contact areas.
should not present device problems provided that the
boards are properly dried to remove solvents or water
residues.
against ESD damage:
– A properly grounded static-dissipative surface on
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each
vacuum collet or along the edges with a sharp pair of
bent tweezers. Avoiding damaging the RF, DC, and
ground contacts on the package bottom. Do not apply
excessive pressure to the top of the lid.
moisture-barrier bags. In this condition, devices are
protected and require no special storage conditions.
Once the sealed bag has been opened, devices should
be stored in a dry nitrogen environment.
The shipping trays cannot withstand 125°C baking
temperature.
removal from the oven.
environment of less than 60% relative humidity and a
maximum temperature of 30°C
been exceeded, then the dry-bake procedure must be
repeated.
which to place devices.
person to wear while handling devices.
Solder Materials & Temperature Profile:
Reflow soldering is the preferred method of SMT
attachment. Hand soldering is not recommended.
Reflow Profile
• Ramp-up: During this stage the solvents are evaporated
• Pre-heat/soak: The soak temperature stage serves two
• Reflow Zone: If the temperature is too high, then devices
• Cooling Zone: Steep thermal gradients may give rise to
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-
free attachment of the heat sink to the PWB. The solder
joint should be 95% void-free and be a consistent
thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow
of the solder with a heat gun. The device should not be
subjected to more than 225°C and reflow solder in the
molten state for more than 5 seconds. No more than 2
rework operations should be performed.
from the solder paste. Care should be taken to prevent
rapid oxidation (or paste slump) and solder bursts
caused by violent solvent out-gassing. A typical heating
rate is 1- 2°C/sec.
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120–150 seconds at 150°C.
may be damaged by mechanical stress due to thermal
mismatch or there may be problems due to excessive
solder oxidation. Excessive time at temperature can
enhance the formation of inter-metallic compounds at
the lead/board interface and may lead to early
mechanical failure of the joint. Reflow must occur prior to
the flux being completely driven off. The duration of peak
reflow temperature should not exceed 10 seconds.
Maximum soldering temperatures should be in the range
215–220°C, with a maximum limit of 225°C.
excessive thermal shock. However, rapid cooling
promotes a finer grain structure and a more crack-
resistant solder joint. The illustration below indicates the
recommended soldering profile.
RMPA2259 Rev. D