MCF5272CVM66 Freescale Semiconductor, MCF5272CVM66 Datasheet - Page 11

IC MPU 66MHZ COLDFIRE 196-MAPBGA

MCF5272CVM66

Manufacturer Part Number
MCF5272CVM66
Description
IC MPU 66MHZ COLDFIRE 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5272CVM66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
196-MAPBGA
Cpu Speed
66MHz
Embedded Interface Type
UART, QSPI, USB, TDM
Digital Ic Case Style
BGA
No. Of Pins
196
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

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Figure
Number
20-4
20-5
20-6
20-7
20-8
20-9
20-10
20-11
20-12
20-13
20-14
20-15
20-16
20-17
20-18
20-19
20-20
20-21
20-22
20-23
20-24
21-1
21-2
21-3
21-4
21-5
21-6
21-7
21-8
22-1
22-2
23-1
23-2
23-3
23-4
23-5
23-6
23-7
23-8
23-9
23-10
23-11
Freescale Semiconductor
Word Write; EBI = 00; 16-/32-Bit Port; Internal Termination ................................................. 20-9
Longword Read with Address Setup; EBI = 00; 32-Bit Port; Internal Termination................ 20-9
Longword Write with Address Setup; EBI = 00; 32-Bit Port; Internal Termination .............. 20-10
Longword Read with Address Hold; EBI = 00; 32-Bit Port; Internal Termination................ 20-10
Longword Write with Address Hold; EBI = 00; 32-Bit Port; Internal Termination ................ 20-11
Longword Read; EBI = 00; 32-Bit Port; Terminated by TA with One Wait State ................ 20-11
Longword Read; EBI=11; 32-Bit Port; Internal Termination................................................ 20-12
Word Write; EBI=11; 16/32-Bit Port; Internal Termination .................................................. 20-13
Read with Address Setup; EBI=11; 32-Bit Port; Internal Termination................................. 20-14
Longword Write with Address Setup; EBI=11; 32-Bit Port; Internal Termination ................ 20-14
Read with Address Hold; EBI=11; 32-Bit Port; Internal Termination................................... 20-15
Longword Write with Address Hold; EBI=11; 32-Bit Port; Internal Termination .................. 20-15
Longword Read with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination ......................................................................... 20-16
Longword Write with Address Setup and Address Hold;
EBI = 11; 32-Bit Port, Internal Termination ......................................................................... 20-17
Example of a Misaligned Longword Transfer...................................................................... 20-18
Example of a Misaligned Word Transfer ............................................................................. 20-18
Longword Write Access To 32-Bit Port Terminated with TEA Timing................................. 20-20
Master Reset Timing ........................................................................................................... 20-22
Normal Reset Timing .......................................................................................................... 20-23
Software Watchdog Timer Reset Timing ............................................................................ 20-24
Soft Reset Timing ............................................................................................................... 20-25
Test Access Port Block Diagram........................................................................................... 21-2
TAP Controller State Machine............................................................................................... 21-3
Output Cell (O.Cell) (BC–1) .................................................................................................. 21-4
Input Cell (I.Cell). Observe only (BC–4)................................................................................ 21-5
Output Control Cell (En.Cell) (BC–4) .................................................................................... 21-5
Bidirectional Cell (IO.Cell) (BC–6)......................................................................................... 21-6
General Arrangement for Bidirectional Pins.......................................................................... 21-6
Bypass Register .................................................................................................................... 21-8
MCF5272 Pinout (196 MAPBGA) ......................................................................................... 22-1
196 MAPBGA Package Dimensions (Case No. 1128A-01) .................................................. 22-2
Clock Input Timing Diagram.................................................................................................. 23-5
General Input Timing Requirements ..................................................................................... 23-7
Read/Write SRAM Bus Timing.............................................................................................. 23-9
SRAM Bus Cycle Terminated by TA ................................................................................... 23-10
SRAM Bus Cycle Terminated by TEA................................................................................. 23-11
Reset and Mode Select/HIZ Configuration Timing.............................................................. 23-12
Real-Time Trace AC Timing................................................................................................ 23-13
BDM Serial Port AC Timing................................................................................................. 23-13
SDRAM Signal Timing ........................................................................................................ 23-15
SDRAM Self-Refresh Cycle Timing .................................................................................... 23-16
MII Receive Signal Timing Diagram.................................................................................... 23-17
MCF5272 ColdFire
List of Figures (Continued)
®
Integrated Microprocessor User’s Manual, Rev. 3
Title
Number
Page
xi

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