MC9S08DN32ACLH Freescale Semiconductor, MC9S08DN32ACLH Datasheet - Page 17

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MC9S08DN32ACLH

Manufacturer Part Number
MC9S08DN32ACLH
Description
IC MCU 32K FLASH 1.5K RAM 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets

Specifications of MC9S08DN32ACLH

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08DN
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SCI, SPI
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Section Number
A.1 Introduction ...................................................................................................................................309
A.2 Parameter Classification ................................................................................................................309
A.3 Absolute Maximum Ratings ..........................................................................................................309
A.4 Thermal Characteristics .................................................................................................................310
A.5 ESD Protection and Latch-Up Immunity ......................................................................................312
A.6 DC Characteristics .........................................................................................................................313
A.7 Supply Current Characteristics ......................................................................................................315
A.8 Analog Comparator (ACMP) Electricals ......................................................................................316
A.9 ADC Characteristics ......................................................................................................................316
A.10 External Oscillator (XOSC) Characteristics .................................................................................320
A.11 MCG Specifications ......................................................................................................................321
A.12 AC Characteristics .........................................................................................................................323
A.13 Flash and EEPROM ......................................................................................................................329
A.14 EMC Performance .........................................................................................................................330
B.1 External Signal Description ...........................................................................................................333
B.2 Register Definition .........................................................................................................................333
B.3 Functional Description ...................................................................................................................339
B.4 TPM Interrupts ...............................................................................................................................343
Freescale Semiconductor
A.12.1 Control Timing ...............................................................................................................323
A.12.2 Timer/PWM ....................................................................................................................324
A.12.3 SPI ...................................................................................................................................326
A.14.1 Radiated Emissions .........................................................................................................330
B.0.1 Features ...........................................................................................................................331
B.0.2 Block Diagram ................................................................................................................331
B.1.1 External TPM Clock Sources ..........................................................................................333
B.1.2 TPMxCHn — TPMx Channel n I/O Pins .......................................................................333
B.2.1 Timer Status and Control Register (TPMxSC) ...............................................................334
B.2.2 Timer Counter Registers (TPMxCNTH:TPMxCNTL) ...................................................335
B.2.3 Timer Counter Modulo Registers (TPMxMODH:TPMxMODL) ..................................336
B.2.4 Timer Channel n Status and Control Register (TPMxCnSC) .........................................337
B.2.5 Timer Channel Value Registers (TPMxCnVH:TPMxCnVL) .........................................338
B.3.1 Counter ............................................................................................................................339
B.3.2 Channel Mode Selection .................................................................................................340
B.3.3 Center-Aligned PWM Mode ...........................................................................................342
B.4.1 Clearing Timer Interrupt Flags .......................................................................................343
B.4.2 Timer Overflow Interrupt Description ............................................................................343
B.4.3 Channel Event Interrupt Description ..............................................................................344
Timer Pulse-Width Modulator (TPMV2)
Electrical Characteristics
MC9S08DN60 Series Data Sheet, Rev 3
Appendix A
Appendix B
Title
Page
17

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