MC9S08DN32ACLH Freescale Semiconductor, MC9S08DN32ACLH Datasheet - Page 133
MC9S08DN32ACLH
Manufacturer Part Number
MC9S08DN32ACLH
Description
IC MCU 32K FLASH 1.5K RAM 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08DN32ACLH
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08DN
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SCI, SPI
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DN32ACLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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8.1.2
There are nine modes of operation for the MCG:
For details see
8.2
There are no MCG signals that connect off chip.
Freescale Semiconductor
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FLL Engaged Internal (FEI)
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed External (FBE)
PLL Engaged External (PEE)
PLL Bypassed External (PBE)
Bypassed Low Power Internal (BLPI)
Bypassed Low Power External (BLPE)
Stop
External Signal Description
Modes of Operation
Section 8.4.1, “Operational
MC9S08DN60 Series Data Sheet, Rev 3
Modes.
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
133
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