DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 789

MCU 3V 384K 100-TQFP

DF2315VTE25

Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2315VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Bit-Rate-Adjustment State
The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 17.83.
Programming/erasing
Operations for Erasing
User MATs and User
selection wait
Transition to
Programming/erasing
Boot MATs
Programming
Operations for
Bit-Rate-Adjustment
Programming
Inquiry/Selection
Figure 17.82 Boot Program States
State
wait
Reset
Inquiry
Erasing
Operations for
Operations for
Inquiry
Erasing
Rev.7.00 Feb. 14, 2007 page 755 of 1108
Selection
Checking
Operations for
Operations for
Selection
Checking
REJ09B0089-0700
Section 17 ROM

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