DF2315VTE25 Renesas Electronics America, DF2315VTE25 Datasheet - Page 826
DF2315VTE25
Manufacturer Part Number
DF2315VTE25
Description
MCU 3V 384K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2315VTE25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2315VTE25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 17 ROM
Table 17.73 (4) Usable Area for Erasure in User Boot Mode
Rev.7.00 Feb. 14, 2007 page 792 of 1108
REJ09B0089-0700
Note: * Switching FMATS by a program in the on-chip RAM enables this area to be used.
Operation for Selection of
On-Chip Program to be
Downloaded
Operation for Writing H'A5
to Key Register
Execution of Writing SC0 =
1 to FCCS (Download)
Operation for Key Register
Clear
Judgement of Download
Result
Operation for Download
Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization
Error
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing H'5A
to Key Register
Operation for Settings of
Erasure Parameter
Execution of Erasure
Judgement of Erasure
Result
Operation for Erasure
Error
Operation for Key Register
Clear
Switching MATs by
FMATS
Item
On-Chip
RAM
Storable/Executable Area
User
Boot
MAT
× *
×
×
×
×
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
×
×
User
MAT
Selected MAT
Boot
User
MAT
Storage Area
Embedded
Program
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