MC68376BAMAB20 Freescale Semiconductor, MC68376BAMAB20 Datasheet - Page 282

• Manufacturer Part Number: MC68376BAMAB20
• Description: IC MCU 32BIT 8K ROM 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: M683xxr

Specifications of MC68376BAMAB20

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Type: ROMless
• Ram Size: 7.5K x 8
• Voltage - Supply (vcc/vdd): 4.75 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 160-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

NOTES:
A-6
10. This parameter is periodically sampled rather than 100% tested.
MOTOROLA
1. Applies to :
2. Input-Only Pins: EXTAL, TSTME/TSC, BKPT, PAI, T2CLK, RXD, CTM2C
3. Does not apply to HALT and RESET because they are open drain pins. Does not apply to port QS[7:0] (TXD,
4. Use of an active pulldown device is recommended.
5. Total operating current is the sum of the appropriate I
6. Current measured at maximum system clock frequency, all modules active.
7. The SRAM module will not switch into standby mode as long as V
8. When V
9. Power dissipation measured at system clock frequency, all modules active. Power dissipation can be calculated us-
Output-Only Pins: CSBOOT, BG/CS, CLKOUT, FREEZE/QUOT, IPIPE
Input/Output Pins:
Pin groups do not include QADC pins. See Tables A-11 through A-14 for information concerning the QADC.
PCS[3:1], PCS0/SS, SCK, MOSI, MISO) in wired-OR mode.
currents for device modules powered by V
volts. The SRAM array cannot be accessed while the module is in standby mode.
the V
specification. System noise on the V
ing the following expression:
STBY
DD
and V
is transitioning during power-up or power down sequence, and V
Port E[7:4] — SIZ[1:0], AS, DS
Port F[7:0] — IRQ[7:1], MODCLK
Port QS[7:0] — TXD, PCS[3:1], PCS0/SS, SCK, MOSI, MISO
TPUCH[15:0], T2CLK, CPWM[8:5], CTD[4:3], CTD[10:9], CTM2C
BKPT/DSCLK, IFETCH, RESET, RXD, TSTME/TSC
EXTAL (when PLL enabled)
Group 1: DATA[15:0], IFETCH, TPUCH[15:0], CPWM[8:5], CTD[4:3], CTD[10:9]
Group 2: Port C[6:0] — ADDR[22:19]/CS[9:6], FC[2:0]/CS[5:3]
ADDR23/CS10/ECLK, ADDR[18:0], R/W, BERR, BR/CS0, BGACK/CS2
Group 3: HALT, RESET
Group 4: MISO, MOSI, SCK
Port E[7:0] — SIZ[1:0], AS, DS, AVEC, RMC, DSACK[1:0]
Port F[7:0] — IRQ[7:1], MODCLK
Port QS[7:3] — TXD, PCS[3:1], PCS0/SS
DD
pins, which causes standby current to increase toward the maximum transient condition
P
D
ELECTRICAL CHARACTERISTICS
= Maximum V
DD
and V
DDE
STBY
and V
DD
pins can contribute to this condition.
(Run I
DDI
DD
, I
pins.
DD
DDSYN
+ I
DDSYN
, and I
SB
does not exceed V
+ I
SB
SB
values. I
) + Maximum V
SB
is applied, current flows between
DD
values include supply
DD
DDA
by more than 0.5
USER’S MANUAL
(I
DDA
MC68336/376
)