UPD70F3744GJ-GAE-AX Renesas Electronics America, UPD70F3744GJ-GAE-AX Datasheet - Page 756

• Manufacturer Part Number: UPD70F3744GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3744GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
27.2 Memory Configuration
All or some of the blocks can also be erased at once.
the physical memory allocated at the addresses of blocks 16 to 31. For details of the boot swap function, see 27.5
Rewriting by Self Programming.
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
The V850ES/JJ3 internal flash memory area is divided into 4 KB blocks and can be programmed/erased in block units.
When the boot swap function is used, the physical memory allocated at the addresses of blocks 0 to 15 is replaced by
CHAPTER 27 FLASH MEMORY
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