DF2367VTE33 Renesas Electronics America, DF2367VTE33 Datasheet - Page 836

IC H8S MCU FLASH 384K 120TQFP

DF2367VTE33

Manufacturer Part Number
DF2367VTE33
Description
IC H8S MCU FLASH 384K 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2367VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VTE33
HD64F2367VTE33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Table 20.8 (4)
Rev.6.00 Mar. 18, 2009 Page 776 of 980
REJ09B0050-0600
Item
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for
Writing H'A5 to
FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for
Settings of Initial
Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling
Routine
Operation for
Interrupt Inhibit
Switching MATs by
FMATS
Operation for
Writing H'5A to
FKEY
Useable Area for Erasure in User Boot Mode
Storable/Executable Area
On-chip
RAM
User
Boot
MAT
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
Selected MAT
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area

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