D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 34
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Section 1 CPU
1.5.2
Figure 1.11 shows the data formats in memory. The CPU can access word data and longword data
in memory, but word or longword data must begin at an even address. If an attempt is made to
access word or longword data at an odd address, no address error occurs but the least significant
bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to
instruction fetches.
When the stack pointer (ER7) is used as an address register to access the stack, the operand size
should be word size or longword size.
Rev. 4.00 Feb 24, 2006 page 18 of 322
REJ09B0139-0400
Memory Data Formats
Data Type
1-bit data
Byte data
Word data
Longword data
Figure 1.11 Memory Data Formats
Address 2M + 1
Address 2N + 1
Address 2N + 2
Address 2N + 3
Address 2M
Address 2N
Address
Address L
Address L
MSB
MSB
MSB
7
7
6
Data Format
5
4
3
2
1
LSB
LSB
LSB
0
0
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