D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 25
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR)
are pushed onto the stack in exception handling, they are stored as shown in figure 1.5. When
EXR is invalid, it is not pushed onto the stack. For details, see the relevant hardware manual.
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored on return.
Reserved
(24 bits)
Figure 1.5 Stack Structure in Advanced Mode
PC
(SP
SP
*2
Rev. 4.00 Feb 24, 2006 page 9 of 322
)
(b) Exception Handling
Reserved
(24 bits)
EXR
CCR
PC
*1
*1 *3
REJ09B0139-0400
Section 1 CPU
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