D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 307

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Figure 2.1 shows timing waveforms for the address bus and the RD and WR (HWR or LWR)
signals during execution of the above instruction with an 8-bit bus, using three-state access with
no wait states.
Address bus
RD
WR (HWR or
LWR)
Figure 2.1 Address Bus, RD
of instruction
Fetching
3rd byte
(8-Bit Bus, Three-State Access, No Wait States)
R:W 2nd
of instruction
Fetching
4th byte
High level
RD
RD, and WR
RD
operation
Internal
WR
WR
WR (HWR
Rev. 4.00 Feb 24, 2006 page 291 of 322
HWR
HWR or LWR
HWR
jump address
instruction at
1st byte of
Fetching
Section 2 Instruction Descriptions
LWR
LWR) Timing
LWR
R:W EA
jump address
instruction at
2nd byte of
Fetching
REJ09B0139-0400

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