D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 246

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Section 2 Instruction Descriptions
STM (STore from Multiple registers)
Operand Format and Number of States Required for Execution
Notes
When ER7 is saved, the value after effective address calculation (after ER7 is decremented by 4)
is saved on the stack.
Rev. 4.00 Feb 24, 2006 page 230 of 322
REJ09B0139-0400
Addressing
Mode
Mnemonic
STM.L
STM.L
STM.L
(ERn–ERn+1),
@–SP
(ERn–ERn+2),
@–SP
(ERn–ERn+3),
@–SP
Operands
0
0
0
1st byte
1
1
1
1
2
3
2nd byte
Instruction Format
0
0
0
6
6
6
3rd byte
D
D
D
Store Data on Stack
F
F
F
4th byte
0
0
0
ern
ern
ern
States
No. of
11
7
9

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