MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 43

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

4.2
The registers in the MC9S08GT16A/GT8A are divided into these three groups:
Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation
instructions can be used to access any bit in any direct-page register.
user-accessible direct-page registers and control bits.
The direct page registers in
requires the lower byte of the address. Because of this, the lower byte of the address in column one is
shown in bold text. In
Table
from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with
a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit
locations that could read as 1s or 0s.
Freescale Semiconductor
•
•
•
4-2,
Direct-page registers are located in the first 128 locations in the memory map, so they are
accessible with efficient direct addressing mode instructions.
High-page registers are used much less often, so they are located above 0x1800 in the memory
map. This leaves more room in the direct page for more frequently used registers and variables.
The nonvolatile register area consists of a block of 16 locations in FLASH memory at
0xFFB0–0xFFBF.
Nonvolatile register locations include:
— Three values which are loaded into working registers at reset
— An 8-byte backdoor comparison key which optionally allows a user to gain controlled access
Because the nonvolatile register locations are FLASH memory, they must be erased and
programmed like other FLASH memory locations.
Register Addresses and Bit Assignments
Table
to secure memory
4-3, and
Table 4-3
Table
Table 4-2
4-4, the register names in column two are shown in bold to set them apart
and
MC9S08GT16A/GT8A Data Sheet, Rev. 1
Table 4-4
can use the more efficient direct addressing mode which only
the whole address in column one is shown in bold. In
Table 4-2
is a summary of all
Memory
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