MC9S08GT16ACFBE Freescale Semiconductor, MC9S08GT16ACFBE Datasheet - Page 252

• Manufacturer Part Number: MC9S08GT16ACFBE
• Description: IC MCU 16K FLASH 2K RAM 44-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08GT16ACFBE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 36
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Processor Series: S08GT
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 36
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: M68EVB908GB60E, M68DEMO908GB60E
• Minimum Operating Temperature: - 40 C
• For Use With: M68DEMO908GB60E - BOARD DEMO MC9S08GB60M68EVB908GB60E - BOARD EVAL FOR MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Active BDM:
Development Support
15.4.1.1
This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL)
but is not accessible to user programs because it is not located in the normal memory map of the MCU.
Reset in
252
Normal
Reset
BDMACT
BKPTEN
ENBDM
CLKSW
Field
FTS
W
7
6
5
4
3
R
ENBDM
Enable BDM (Permit Active Background Mode) — Typically, this bit is written to 1 by the debug host shortly
after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal
reset clears it.
0 BDM cannot be made active (non-intrusive commands still allowed)
1 BDM can be made active to allow active background mode commands
Background Mode Active Status — This is a read-only status bit.
0 BDM not active (user application program running)
1 BDM active and waiting for serial commands
BDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select)
control bit and BDCBKPT match register are ignored.
0 BDC breakpoint disabled
1 BDC breakpoint enabled
Force/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the
BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register
causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue,
the CPU enters active background mode rather than executing the tagged opcode.
0 Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that
1 Breakpoint match forces active background mode at next instruction boundary (address need not be an
Select Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC
clock source.
0 Alternate BDC clock source
1 MCU bus clock
0
1
7
BDC Status and Control Register (BDCSCR)
instruction
opcode)
= Unimplemented or Reserved
BDMACT
Figure 15-5. BDC Status and Control Register (BDCSCR)
0
1
6
Table 15-2. BDCSCR Register Field Descriptions
BKPTEN
MC9S08GT16A/GT8A Data Sheet, Rev. 1
0
0
5
FTS
0
0
4
Description
CLKSW
0
1
3
WS
0
0
2
Freescale Semiconductor
WSF
1
0
0
DVF
0
0
0