STM32F103RET6TR STMicroelectronics, STM32F103RET6TR Datasheet - Page 44
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STM32F103RET6TR
Manufacturer Part Number
STM32F103RET6TR
Description
MCU ARM 32BIT 512KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VCT6.pdf
(123 pages)
Specifications of STM32F103RET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
497-10508 - BOARD EVAL FOR MEMS SENSORS497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Electrical characteristics
5.3.4
5.3.5
44/123
Embedded reference voltage
The parameters given in
temperature and V
Table 13.
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in
measurement
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to Dhrystone 2.1 code.
Maximum current consumption
The MCU is placed under the following conditions:
●
●
●
●
●
The parameters given in
under ambient temperature and V
T
V
Symbol
V
S_vrefint
T
RERINT
Coeff
REFINT
All I/O pins are in input mode with a static value at V
All peripherals are disabled except when explicitly mentioned
The Flash memory access time is adjusted to the f
to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above)
Prefetch in ON (reminder: this bit must be set before clock setting and bus prescaling)
When the peripherals are enabled f
(2)
(2)
(1)
Internal reference voltage
ADC sampling time when
reading the internal reference
voltage
Internal reference voltage
spread over the temperature
range
Temperature coefficient
Embedded internal reference voltage
scheme.
DD
Parameter
supply voltage conditions summarized in
Table 13
Table
Doc ID 14611 Rev 7
14,
DD
are derived from tests performed under ambient
Table 15
supply voltage conditions summarized in
PCLK1
–40 °C < T
–40 °C < T
V
STM32F103xC, STM32F103xD, STM32F103xE
DD
and
Conditions
= 3 V ±10 mV
= f
Table 16
HCLK
A
A
< +105 °C
< +85 °C
/2, f
Figure 13: Current consumption
HCLK
DD
are derived from tests performed
PCLK2
or V
frequency (0 wait state from 0
Table
1.16 1.20
1.16 1.20
Min
= f
SS
HCLK
(no load)
10.
5.1
Typ
1.26
1.24
17.1
Max
100
10
Table
(2)
ppm/°C
10.
Unit
mV
µs
V
V