STM32F103RET6TR STMicroelectronics, STM32F103RET6TR Datasheet - Page 104
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STM32F103RET6TR
Manufacturer Part Number
STM32F103RET6TR
Description
MCU ARM 32BIT 512KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VCT6.pdf
(123 pages)
Specifications of STM32F103RET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
497-10508 - BOARD EVAL FOR MEMS SENSORS497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103RET6TR
Manufacturer:
ST
Quantity:
872
Company:
Part Number:
STM32F103RET6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
Table 62.
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.
Figure 57. 12-bit buffered /non-buffered DAC
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
104/123
Offset
Gain
error
t
Update
rate
t
PSRR+
SETTLING
WAKEUP
Symbol
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
(2)
(2)
(2)
(1)
(2)
(2)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value =
V
Gain error
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±1LSB
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
Power supply rejection ratio
(to V
measurement
DAC characteristics (continued)
REF+
DDA
/2)
) (static DC
Parameter
Buffered/Non-buffered DAC
12-bit
digital to
analog
converter
Min
Doc ID 14611 Rev 7
3
6.5
–67
Buffer(1)
Typ
±10
±3
±12
±0.5
4
1
10
–40
STM32F103xC, STM32F103xD, STM32F103xE
Max
DACx_OUT
mV
LSB
LSB
%
µs
MS/s C
µs
dB
Unit
C
R
Given for the DAC in 12-bit
configuration
Given for the DAC in 10-bit at V
= 3.6 V
Given for the DAC in 12-bit at V
= 3.6 V
Given for the DAC in 12bit
configuration
C
C
input code between lowest and
highest possible ones.
No R
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
50 pF, R
50 pF, R
50 pF, R
, C
LOAD
Comments
ai17157
LOAD
LOAD
LOAD
= 50 pF
5 k
5 k
5 k
REF+
REF+