STM32F103RET6TR STMicroelectronics, STM32F103RET6TR Datasheet - Page 114
![MCU ARM 32BIT 512KB FLASH 64LQFP](/photos/12/15/121504/stmicroelectronics-64-lqfp_sml.jpg)
STM32F103RET6TR
Manufacturer Part Number
STM32F103RET6TR
Description
MCU ARM 32BIT 512KB FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103VCT6.pdf
(123 pages)
Specifications of STM32F103RET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
497-10508 - BOARD EVAL FOR MEMS SENSORS497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103RET6TR
Manufacturer:
ST
Quantity:
872
Company:
Part Number:
STM32F103RET6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Package characteristics
6.2
6.2.1
114/123
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 70.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Symbol
I/O
JA
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64
max is the product of I
Package thermal characteristics
OL
× I
OL
INT
T
) + ((V
J
Doc ID 14611 Rev 7
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
STM32F103xC, STM32F103xD, STM32F103xE
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
42.
/ I
OH
D
OH
),
max x
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
Value
40
30
40
46
45
50
I/O
max),
°C/W
Unit