ST72C254G2M6 STMicroelectronics, ST72C254G2M6 Datasheet - Page 5
![IC MCU 8BIT 8K FLASH SOIC-28](/photos/6/56/65690/stmicroelectronics-28-soic_sml.jpg)
ST72C254G2M6
Manufacturer Part Number
ST72C254G2M6
Description
IC MCU 8BIT 8K FLASH SOIC-28
Manufacturer
STMicroelectronics
Series
ST7r
Datasheets
1.INDART-ST72C254.pdf
(3 pages)
2.ST72C104G1M6.pdf
(141 pages)
3.ST72C215G2M6.pdf
(140 pages)
Specifications of ST72C254G2M6
Core Processor
ST7
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3.2 V ~ 5.5 V
Data Converters
A/D 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
ST7
No. Of I/o's
22
Ram Memory Size
256Byte
Cpu Speed
8MHz
No. Of Timers
2
Rohs Compliant
Yes
Processor Series
ST72C2x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SPI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
22
Number Of Timers
3 bit
Operating Supply Voltage
3.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7MDT1-DVP2/US
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
In Transition
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST72C254G2M6
Manufacturer:
ST
Quantity:
20 000
15 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
16 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . 133
17 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
14.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
14.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
14.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 125
14.12 8-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
15.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
15.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
15.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
16.1 OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
16.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 134
16.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
16.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
16.5 TO GET MORE INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
14.8.1General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
14.8.2Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
14.9.1Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
14.9.2ISPSEL Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
14.10.1Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
14.10.216-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
14.11.1SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
14.11.2I2C - Inter IC Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
16.3.1PACKAGE/SOCKET FOOTPRINT PROPOSAL . . . . . . . . . . . . . . . . . . . . . . . . . . 137
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