ST7FLI49MK1T6 STMicroelectronics, ST7FLI49MK1T6 Datasheet - Page 156

• Manufacturer Part Number: ST7FLI49MK1T6
• Description: MCU 8BIT SGL VOLT FLASH 32-LQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FLI49MK1T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 24
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Processor Series: ST7FLI4x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: I2C
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical characteristics
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13.8.1
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EMC (electromagnetic compatibility) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling two LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
●
●
Table 79.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A burst of fast transient voltage (positive and negative) is applied to V
through a 100 pF capacitor, until a functional disturbance occurs. This test conforms
with the IEC 1000-4-4 standard.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
–
–
–
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can
be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins
for 1 second.
To complete these trials, ESD stress can be applied directly on the device, over the
range of specification values. When unexpected behavior is detected, the software can
be hardened to prevent unrecoverable errors occurring (see application note AN1015).
Corrupted program counter
Unexpected reset
Critical data corruption (control registers...)
Voltage limits to be applied on any I/O pin
applied through 100 pF on V
Fast transient voltage burst limits to be
pins to induce a functional disturbance
EMS test results
to induce a functional disturbance
Parameter
Doc ID 13562 Rev 3
DD
and V
SS
V
V
DD
DD
conforms to IEC 1000-4-2
conforms to IEC 1000-4-4
=5 V, T
=5 V, T
A
A
Conditions
=+25 °C, f
=+25 °C, f
OSC
OSC
=8 MHz
=8 MHz
ST7LITE49M
DD
and V
Level/
Class
2B
3B
SS