DSPIC30F6015-20E/PT Microchip Technology, DSPIC30F6015-20E/PT Datasheet - Page 36
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DSPIC30F6015-20E/PT
Manufacturer Part Number
DSPIC30F6015-20E/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6015-30IPT.pdf
(232 pages)
4.DSPIC30F6015-30IPT.pdf
(14 pages)
5.DSPIC30F6015-30IPT.pdf
(12 pages)
6.DSPIC30F6015-30IPT.pdf
(18 pages)
Specifications of DSPIC30F6015-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP
Quantity:
1 143
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6010A/6015
4.1.3
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing
instructions, Move and Accumulator instructions also
support Register Indirect with Register Offset Address-
ing mode, also referred to as Register Indexed mode.
In summary, the following addressing modes are
supported by Move and Accumulator instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-Modified
• Register Indirect Pre-Modified
• Register Indirect with Register Offset (Indexed)
• Register Indirect with Literal Offset
• 8-bit Literal
• 16-bit Literal
4.1.4
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through Register Indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data reads,
W8 and W9 will always be directed to the X RAGU and
W10 and W11 will always be directed to the Y AGU. The
Effective Addresses generated (before and after
modification) must, therefore, be valid addresses within
X data space for W8 and W9 and Y data space for W10
and W11.
DS70150D-page 36
Note:
Note:
Note:
MOVE AND ACCUMULATOR
INSTRUCTIONS
For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (Register Offset)
field is shared between both source and
destination (but typically only used by
one).
Not all instructions support all the address-
ing
instructions may support different subsets
of these addressing modes.
MAC INSTRUCTIONS
Register Indirect with Register Offset
Addressing is only available for W9 (in X
space) and W11 (in Y space).
modes
modes
supported
given
above.
by
most
Individual
MCU
In summary, the following addressing modes are
supported by the MAC class of instructions:
• Register Indirect
• Register Indirect Post-Modified by 2
• Register Indirect Post-Modified by 4
• Register Indirect Post-Modified by 6
• Register Indirect with Register Offset (Indexed)
4.1.5
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Modulo
Addressing can operate on any W register pointer.
However, it is not advisable to use W14 or W15 for
Modulo Addressing, since these two registers are used
as the Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain restrictions on the buffer start address (for
incrementing buffers) or end address (for decrementing
buffers) based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a Bidirectional mode, (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
Modulo Addressing
OTHER INSTRUCTIONS
© 2008 Microchip Technology Inc.