DSPIC30F6015-20E/PT Microchip Technology, DSPIC30F6015-20E/PT Datasheet - Page 218
![IC DSPIC MCU/DSP 144K 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
DSPIC30F6015-20E/PT
Manufacturer Part Number
DSPIC30F6015-20E/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6015-30IPT.pdf
(232 pages)
4.DSPIC30F6015-30IPT.pdf
(14 pages)
5.DSPIC30F6015-30IPT.pdf
(12 pages)
6.DSPIC30F6015-30IPT.pdf
(18 pages)
Specifications of DSPIC30F6015-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP
Quantity:
1 143
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6010A/6015
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70150D-page 218
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2008 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
α
A2