DSPIC30F6015-20E/PT Microchip Technology, DSPIC30F6015-20E/PT Datasheet - Page 178
![IC DSPIC MCU/DSP 144K 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
DSPIC30F6015-20E/PT
Manufacturer Part Number
DSPIC30F6015-20E/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6015-30IPT.pdf
(232 pages)
4.DSPIC30F6015-30IPT.pdf
(14 pages)
5.DSPIC30F6015-30IPT.pdf
(12 pages)
6.DSPIC30F6015-30IPT.pdf
(18 pages)
Specifications of DSPIC30F6015-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP
Quantity:
1 143
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6010A/6015
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70150D-page 178
dsPIC30F6010A-30I/dsPIC30F6015-30I
dsPIC30F6010A-20E/dsPIC30F6015-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
V
(in Volts)
(in Volts)
DD
DD
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DC Characteristics
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
4.5-5.5
4.5-5.5
3.0-3.6
3.0-3.6
2.5-3.0
I
/
INT
O
Junction to ambient thermal resistance, Theta-ja (
Range
Range
=
=
∑
V
(
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6010A
OPERATING MIPS VS. VOLTAGE FOR dsPIC30F6015
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
{
V
×
D D
(
I
DD
–
V
Characteristic
–
O H
∑
} I
Rating
×
I
O H
Temp Range
Temp Range
OH
-40 to +125
-40 to +125
-40 to +125
-40 to +125
)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
)
(in °C)
(in °C)
+
∑
(
V
OL
×
I
OL
)
dsPIC30F6010A-30I
dsPIC30F6015-30I
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
30
—
20
—
10
P
DMAX
θ
θ
θ
P
T
T
T
T
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
Max MIPS
-40
-40
-40
-40
36
39
39
(T
© 2008 Microchip Technology Inc.
P
J
INT
– T
Max
dsPIC30F6010A-20E
Typ
—
—
—
—
—
—
—
dsPIC30F6015-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
20
15
20
15
—
—
—
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1