DSPIC30F6015-20E/PT Microchip Technology, DSPIC30F6015-20E/PT Datasheet

IC DSPIC MCU/DSP 144K 64TQFP

DSPIC30F6015-20E/PT

Manufacturer Part Number
DSPIC30F6015-20E/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6015-20E/PT

Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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The dsPIC30F6010A/6015 family devices that you have
received conform functionally to the current Device Data
Sheet (DS70150D), except for the anomalies described
in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in Table 1. The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of the dsPIC30F6010A/6015 silicon.
Data Sheet clarifications and corrections start on page 14,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB
programmers, debuggers and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
TABLE 1:
© 2010 Microchip Technology Inc.
dsPIC30F6010A
dsPIC30F6015
Note 1:
Note:
2:
The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in
program memory.
Refer to the “dsPIC30F Flash Programming Specification” (DS70102) for detailed information on Device
and Revision IDs for your specific device.
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2 apply to the current silicon revision
(A4).
Part Number
SILICON DEVREV VALUES
Silicon Errata and Data Sheet Clarification
®
dsPIC30F6010A/6015 Family
IDE and Microchip’s
dsPIC30F6010A/6015
Device ID
0x0281
0x0280
(1)
For example, to identify the silicon revision level using
MPLAB IDE in conjunction with MPLAB ICD 2 or
PICkit™ 3:
1.
2.
3.
4.
The Device and Revision ID values for the various
dsPIC30F6010A/6015 silicon revisions are shown in
Table 1.
Note:
Using the appropriate interface, connect the device
to the MPLAB ICD 2 programmer/debugger or
PICkit 3.
From the main menu in MPLAB IDE, select
Configure>Select Device, and then select the
target part number in the dialog box.
Select
(Debugger>Select Tool).
Perform a “Connect” operation to the device
(Debugger>Connect). Depending on the devel-
opment tool used, the part number and Device
Revision ID value appear in the Output window.
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
the
Revision ID for Silicon Revision
0x1002
A2
MPLAB
0x1003
A3
hardware
DS80458C-page 1
0x1004
A4
tool
(2)

Related parts for DSPIC30F6015-20E/PT

DSPIC30F6015-20E/PT Summary of contents

Page 1

... Microchip corporate web site (www.microchip.com). TABLE 1: SILICON DEVREV VALUES Part Number dsPIC30F6010A dsPIC30F6015 Note 1: The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in program memory. 2: Refer to the “dsPIC30F Flash Programming Specification” (DS70102) for detailed information on Device and Revision IDs for your specific device. © ...

Page 2

... When the I C module is configured as a 10-bit slave with an address of 0x102, the I2CxRCV register content for the lower address byte is 0x01 rather than 0x02. Affected (1) Revisions devices, the © 2010 Microchip Technology Inc. ...

Page 3

... Current 22. Consumption in Sleep Mode Note 1: Only those issues indicated in the last column apply to the current silicon revision. © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 Issue Summary 2 When the I C module is enabled, the dsPIC generates a glitch on the SDA and SCL pins, causing a false communication start in a single-master configuration or a bus collision in a multi-master configuration ...

Page 4

... Load a value greater than ‘0’ to the OCxRS register when operating in PWM mode. In this case duty cycle is achievable the application requires 0% duty cycles, the output compare module disabled for 0% duty cycles, and re-enabled for non-zero percent duty cycles. Affected Silicon Revisions © 2010 Microchip Technology Inc can be ...

Page 5

... Affected Silicon Revisions © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 5. Module: ADC ADC event triggers from the INT0 pin will not wake-up the device from Sleep mode if the SMPI bits are non-zero. This means that if the ADC is configured to generate an interrupt after a certain ...

Page 6

... A/D Channels Configuration REF REF CH X ANx S/H ADC REF REF ANx S/H ADC ANx REF REF REF ANx S/H ADC ANx REF © 2010 Microchip Technology Inc. ...

Page 7

... User's code } void __attribute__((__interrupt__)) _QEIInterrupt(void) { IFSxbits.QEIIF = 0; POSCNT_b15 ^= 0x8000; // Overflow or Underflow } © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 Work around To prevent this condition from occurring, set MAXCNT to 0x7FFF, which will cause an interrupt to be generated by the QEI module. In addition, a global variable could be used to keep ...

Page 8

... GotoSleep( ) function call. This ensures that the device continues executing the correct code sequence after waking up from Sleep mode. Example 2 described above. ; Ensure flag is reset ; Return from Interrupt Service Routine the function call would be demonstrates the work around © 2010 Microchip Technology Inc. ...

Page 9

... Note: The above work around is recommended for users for whom application hardware changes are not possible. © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 Work around 3: Instead of executing a PWRSAV #0 instruction to put the device into Sleep mode, perform a clock switch to the 32 kHz Low-Power (LP) Oscillator with a 64:1 postscaler mode ...

Page 10

... If the PTDIR bit is set (when PTMR is counting down), and the CPU execution is halted (after a breakpoint is reached), PTMR will start counting PTDIR was zero. Work around None. Affected Silicon Revisions © 2010 Microchip Technology Inc slave interrupt 2 C nodes receive 2 C data 2 C nodes. This ...

Page 11

... Affected Silicon Revisions © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 14. Module: PLL The PLL LOCK Status bit (OSCCON<5>) can occasionally get cleared and generate an oscillator failure trap even when the PLL is still locked and functioning correctly. Work around The user application must include an oscillator failure trap service routine ...

Page 12

... C bus, and can cause 2 C module are set to values ‘1’ and 2 C module and the first data 2 C masters should be synchro module to be initialized 2 C module is with other modules that have 2 C module module © 2010 Microchip Technology Inc. ...

Page 13

... QEI in Timer Gated Accumulation mode, initialize MAXCNT = 0. Affected Silicon Revisions © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 22. Module: ADC If the ADC module enabled state when the device enters Sleep mode as a result of executing a PWRSAV #0 instruction, the device power-down current (I ) may exceed the specifications listed PD in the device data sheet ...

Page 14

... Standard Operating Conditions: 3.3V and 5.0V (±10%) (unless otherwise stated) Operating temperature Min Typ Max V — 0.8 SS 2.1 — -40°C ≤ T ≤ +85°C for Industrial A -40°C ≤ T ≤ +125°C for Extended A Units Conditions V SMbus enabled V SMbus enabled © 2010 Microchip Technology Inc. ...

Page 15

... DS80400, “dsPIC30F6010A/6015 Rev. A4 Silicon Errata” Rev B Document (8/2009) Added silicon issues 20 (QEI) and 21 (QEI). Rev C Document (6/2010) Added silicon issues 22 (ADC) and data sheet clarification 1 (DC Characteristics: I/O Pin Input Specifications). © 2010 Microchip Technology Inc. dsPIC30F6010A/6015 2 C), 13 (Timer and 19 DS80458C-page 15 ...

Page 16

... NOTES: DS80458C-page 16 © 2010 Microchip Technology Inc. ...

Page 17

... PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 18

... Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2010 Microchip Technology Inc. 01/05/10 ...

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