PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 375

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision A (June 2003)
Original data sheet for PIC18F2331/2431/4331/4431
devices.
Revision B (December 2003)
The Electrical Specifications in
cal Characteristics”
have been minor corrections to the data sheet text.
Revision C (June 2007)
The data sheet has been updated with all known Data
Sheet Errata items and there have been minor
corrections made to the data sheet text. Also, the
packaging
Section 27.0 “Packaging
TABLE B-1:
 2010 Microchip Technology Inc.
Program Memory (Bytes)
Program Memory (Instructions)
Interrupt Sources
I/O Ports
Capture/Compare/PWM Modules
Enhanced Capture/Compare/
PWM Modules
10-Bit Analog-to-Digital Module
Packages
Features
diagrams
DEVICE DIFFERENCES
REVISION HISTORY
have been updated and there
have
Information”.
Section 26.0 “Electri-
been
Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E Ports A, B, C, D, E
5 Input Channels
28-Pin SPDIP
PIC18F2331
28-Pin SOIC
28-Pin QFN
updated
4096
2048
22
2
1
PIC18F2331/2431/4331/4431
in
5 Input Channels
28-Pin SPDIP
PIC18F2431
28-Pin SOIC
28-Pin QFN
Revision D (September 2010)
Section 2.0 “Guidelines for Getting Started with
PIC18F Microcontrollers”
more detailed explanations. Changes have been made
to the port summary tables in
Ports”.
has been updated to include extended temperature
data. Packaging diagrams have been replaced with
new
Information”. There have been minor text edits
throughout the document.
APPENDIX B:
The differences between the devices listed in this data
sheet are shown in
8192
4096
22
1
2
diagrams
Section 26.0 “Electrical Characteristics”
9 Input Channels
44-Pin TQFP
PIC18F4331
40-Pin PDIP
44-Pin QFN
Table
in
4096
2048
34
DEVICE
DIFFERENCES
2
1
Section 27.0
B-1.
has been updated with
DS39616D-page 375
Section 11.0 “I/O
9 Input Channels
44-Pin TQFP
PIC18F4431
40-Pin PDIP
44-Pin QFN
8192
4096
“Packaging
34
2
1