PIC18F2431-I/SO Microchip Technology, PIC18F2431-I/SO Datasheet - Page 252

• Manufacturer Part Number: PIC18F2431-I/SO
• Description: IC PIC MCU FLASH 8KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2431-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: EUSART/I2C/SPI/SSP
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183021, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3-DB18F4431 - BOARD DAUGHTER ICEPIC3
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2331/2431/4331/4431
21.7
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed mode.
If the A/D is expected to operate while the device is in
a power-managed mode, the ACQT<3:0> and
ADCS<2:0> bits in ADCON2 should be updated in
accordance with the power-managed mode clock that
will be used. After the power-managed mode is entered
(either of the power-managed Run modes), an A/D
acquisition or conversion may be started. Once an
acquisition or conversion is started, the device should
continue to be clocked by the same power-managed
mode clock source until the conversion has been com-
pleted. If desired, the device may be placed into the
corresponding power-managed Idle mode during the
conversion.
If the power-managed mode clock frequency is less
than 1 MHz, the A/D RC clock source should be
selected.
Operation in Sleep mode requires the A/D RC clock to
be selected. If bits, ACQT<3:0>, are set to ‘0000’ and
a conversion is started, the conversion will be delayed
one instruction cycle to allow execution of the SLEEP
instruction and entry to Sleep mode. The IDLEN and
SCS bits in the OSCCON register must have already
been cleared prior to starting the conversion.
DS39616D-page 252
Note:
Operation in Power-Managed
Modes
The A/D can operate in Sleep mode only
when configured for Single-Shot mode. If
the part is in Sleep mode, and it is possible
for a source other than the A/D module to
wake the part, the user must poll
ADCON0<GO/DONE> to ensure it is clear
before reading the result.
21.8
The ANSEL0, ANSEL1, TRISA and TRISE registers all
configure the A/D port pins. The port pins needed as
analog inputs must have their corresponding TRIS bits
set (input). If the TRIS bit is cleared (output), the digital
output level (V
The A/D operation is independent of the state of the
ANSEL0, ANSEL1 and TRIS bits.
Note 1: When reading the PORT register, all pins
2: Analog levels on any pin defined as a
Configuring Analog Port Pins
configured as analog input channels will
read as cleared (a low level). Pins
configured as digital inputs will convert an
analog input. Analog levels on a digitally
configured input will be accurately
converted.
digital input may cause the digital input
buffer to consume current out of the
device’s specification limits.
OH
or V
OL
 2010 Microchip Technology Inc.
) will be converted.