ATMEGA32U2-MU Atmel, ATMEGA32U2-MU Datasheet - Page 31
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ATMEGA32U2-MU
Manufacturer Part Number
ATMEGA32U2-MU
Description
MCU AVR USB 32K FLASH IND 32VQFN
Manufacturer
Atmel
Series
AVR® ATmegar
Specifications of ATMEGA32U2-MU
Core Processor
AVR
Core Size
8-Bit
Speed
16MHz
Connectivity
SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Processor Series
ATMEGA32x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
2.5 KB
Interface Type
SPI, UART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
22
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, AT90USBKEY, ATEVK525
Minimum Operating Temperature
- 40 C
For Use With
ATSTK524 - KIT STARTER ATMEGA32M1/MEGA32C1ATSTK600 - DEV KIT FOR AVR/AVR32ATAVRDRAGON - KIT DRAGON 32KB FLASH MEM AVRATSTK500 - PROGRAMMER AVR STARTER KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Details
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- Download datasheet (6Mb)
7799D–AVR–11/10
The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in
8-4.
Table 8-4.
Notes:
Table 8-5.
Note:
Oscillator Source /
Power Conditions
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Ceramic resonator, BOD
enabled
Ceramic resonator, fast
rising power
Ceramic resonator, slowly
rising power
Crystal Oscillator, BOD
enabled
Crystal Oscillator, fast
rising power
Crystal Oscillator, slowly
rising power
Power Conditions
BOD enabled
Fast rising power
Slowly rising power
3. If 8 MHz frequency exceeds the specification of the device (depends on V
1. These options should only be used when not operating close to the maximum frequency of the
2. These options are intended for use with ceramic resonators and will ensure frequency stability
1.
The device is shipped with this option selected.
Fuse can be programmed in order to divide the internal frequency by 8. It must be ensured
that the resulting divided clock meets the frequency specification of the device.
device, and only if frequency stability at start-up is not important for the application. These
options are not suitable for crystals.
at start-up. They can also be used with crystals when not operating close to the maximum fre-
quency of the device, and if frequency stability at start-up is not important for the application.
Start-up Times for the Low Power Crystal Oscillator Clock Selection
Start-up times for the internal calibrated RC Oscillator clock selection
Start-up Time from
Start-up Time from Power-
Power-down and
down and Power-save
Power-save
16K CK
16K CK
16K CK
258 CK
258 CK
1K CK
1K CK
1K CK
Reserved
6 CK
6 CK
6 CK
ATmega8U2/16U2/32U2
Additional Delay
14CK + 4.1 ms
14CK + 4.1 ms
14CK + 65 ms
14CK + 65 ms
14CK + 4.1 ms
14CK + 65 ms
(V
from Reset
CC
14CK
14CK
= 5.0V)
Additional Delay from
Reset (V
(2)
14CK + 65 ms
14CK + 4.1 ms
(1)
(2)
(1)
(2)
14CK
CC
= 5.0V)
CKSEL0
(1)
CC
0
0
0
0
1
1
1
1
), the CKDIV8
SUT1..0
SUT1..0
00
01
10
00
01
10
00
01
10
11
11
11
Table
31
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