PIC16F819-I/ML Microchip Technology, PIC16F819-I/ML Datasheet - Page 66

• Manufacturer Part Number: PIC16F819-I/ML
• Description: IC MCU FLASH 2KX14 EEPROM 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F819-I/ML

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC16F
• No. Of I/o's: 16
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28QFN3 - SOCKET TRAN ICE 18DIP/28QFNAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNAC164033 - ADAPTER 28QFN TO 18DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Details

PICmicro MID-RANGE MCU FAMILY
3.4
DS31003A-page 3-16
Design Tips
Question 1:
Answer 1:
If the device you are using does not have filtering to the on-chip master clear circuit
ensure that proper external filtering is placed on the MCLR pin to remove narrow pulses. Electri-
cal Specification
Question 2:
Answer 2:
The most common reason for this is that the windowed device (JW) has not had its window cov-
ered. The background light causes the device to power-up in a different state than would typically
be seen in a device where no light is present. In most cases all the General Purpose RAM and
Special Function Registers were not initialized properly.
When my system is subjected to an environment with ESD and EMI, it oper-
ates erratically.
With JW (windowed) devices my system resets and operates properly. With
an OTP device, my system does not operate properly.
parameter 35
specifies the pulse width required to cause a reset.
1997 Microchip Technology Inc.
(Appendix
C),