PIC16F819-I/ML Microchip Technology, PIC16F819-I/ML Datasheet - Page 38

• Manufacturer Part Number: PIC16F819-I/ML
• Description: IC MCU FLASH 2KX14 EEPROM 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F819-I/ML

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC16F
• No. Of I/o's: 16
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28QFN3 - SOCKET TRAN ICE 18DIP/28QFNAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNAC164033 - ADAPTER 28QFN TO 18DIPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Details

PICmicro MID-RANGE MCU FAMILY
2.3.3
DS31002A-page 2-8
Tuning the Oscillator Circuit
Since Microchip devices have wide operating ranges (frequency, voltage, and temperature;
depending on the part and version ordered) and external components (crystals, capacitors,...),
of varying quality and manufacture; validation of operation needs to be performed to ensure that
the component selection will comply with the requirements of the application.
There are many factors that go into the selection and arrangement of these external components.
These factors include:
• amplifier gain
• desired frequency
• resonant frequency(s) of the crystal
• temperature of operation
• supply voltage range
• start-up time
• stability
• crystal life
• power consumption
• simplification of the circuit
• use of standard components
• combination which results in fewest components
1997 Microchip Technology Inc.