PIC18F1220-I/SS Microchip Technology, PIC18F1220-I/SS Datasheet - Page 32

IC MCU FLASH 2KX16 A/D 20SSOP

PIC18F1220-I/SS

Manufacturer Part Number
PIC18F1220-I/SS
Description
IC MCU FLASH 2KX16 A/D 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F1220-I/SS

Program Memory Type
FLASH
Program Memory Size
4KB (2K x 16)
Package / Case
20-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
16
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Package
20SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPAC164307 - MODULE SKT FOR PM3 28SSOPAC164018 - MODULE SKT PROMATEII 20SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC18F1230/1330
6.0
DS39752B-page 32
Standard Operating Conditions
Operating Temperature: 25°C is recommended
Param
D110
D110A V
D111
D112
D113
D031
D041
D080
D090
D012
P1
P2
P2A
P2B
P3
P4
P5
P5A
P6
P9
P10
P11
Note 1:
No.
2:
3:
V
V
I
I
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
AC/DC CHARACTERISTICS TIMING REQUIREMENTS
FOR PROGRAM/VERIFY TEST MODE
Sym
R
PGC
PGCL
PGCH
SET
HLD
DLY
DLY
DLY
DLY
DLY
DLY
IHH
IHL
DD
IL
IH
OL
OH
IO
Do not allow excess time when transitioning MCLR between V
executions to occur. The maximum transition time is:
where T
specific values, refer to the Electrical Characteristics section of the device data sheet for the particular device.
This specification also applies to ICV
At 0°C-50°C.
1
1 Input Data Setup Time to Serial Clock ↓
1 Delay between 4-bit Command and Command
2 Delay between Last PGC ↓ of Command Byte to
5 PGC High Time (minimum programming time)
6 PGC Low Time after Programming
7 Delay to allow Self-Timed Data Write or
1 Input Data Hold Time from PGC ↓
A
1 T
2 ms (for HS/PLL mode only) + 1.5 μs (for EC mode only)
High-Voltage Programming Voltage on
MCLR/V
Low-Voltage Programming Voltage on
MCLR/V
Supply Voltage During Programming
Programming Current on MCLR/V
Supply Current During Programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O pin (PGD)
MCLR/V
Program/Verify mode
Serial Clock (PGC) Period
Serial Clock (PGC) Low Time
Serial Clock (PGC) High Time
Operand
Delay between 4-bit Command Operand and Next
4-bit Command
First PGC ↑ of Read of Data Word
(high-voltage discharge time)
Bulk Erase to Occur
CY
CY
+ T
is the instruction cycle time, T
PWRT
PP
PP
PP
/RA5/FLTA
/RA5/FLTA
/RA5/FLTA Rise Time to Enter
(if enabled) + 1024 T
Characteristic
PP
OSC
PP
for the PIC18F1330-ICD device.
PWRT
/RA5/FLTA
(for LP, HS, HS/PLL and XT modes only) +
is the Power-up Timer period and T
V
V
0.8 V
DD
DD
2.00
2.00
3.00
Min
V
100
400
400
100
40
40
15
15
40
40
20
1
1
5
SS
+ 4.0
– 0.7
IL
DD
and V
0.2 V
Max
12.5
5.50
5.50
5.50
V
300
0.6
1.0
10
50
IHH
DD
DD
; this can cause spurious program
Units
mA
ms
μA
ms
pF
μs
ns
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
μs
V
V
V
V
V
V
V
V
© 2009 Microchip Technology Inc.
OSC
(Note 2)
(Note 2)
Externally timed,
row erases and all writes
Self-timed,
bulk erases only (Note 3)
(Note 2)
I
I
To meet AC specifications
(Notes 1, 2)
V
V
V
V
V
V
Externally Timed
OL
OH
is the oscillator period. For
DD
DD
DD
DD
DD
DD
= 8.5 mA @ 4.5V
= -3.0 mA @ 4.5V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
Conditions

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