PIC16LF1826-I/MV Microchip Technology, PIC16LF1826-I/MV Datasheet - Page 14

• Manufacturer Part Number: PIC16LF1826-I/MV
• Description: IC MCU 8BIT FLASH 28UQFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16LF1826-I/MV

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-UFQFN Exposed Pad
• Controller Family/series: PIC16LF
• No. Of I/o's: 16
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 32MHz
• No. Of Timers: 3
• Processor Series: PIC16LF
• Core: PIC
• Data Ram Size: 256 B
• Maximum Clock Frequency: 32 KHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC16F/LF1826/27
TABLE 1-2:
DS41391C-page 14
RA6/OSC2/CLKOUT/CLKR/
P1D
RA7/OSC1/CLKIN/P1C
CCP2
RB0/T1G/CCP1
SRI/FLT0
RB1/AN11/CPS11/RX
DT
RB2/AN10/CPS10/MDMIN/
TX
SDA2
Legend: AN = Analog input or output CMOS = CMOS compatible input or output
Note 1: Pin functions can be moved using the APFCON0 or APFCON1 register.
(1,3)
(1,3)
(1)
(2)
(1,2)
2: Functions are only available on the PIC16F/LF1827.
3: Default function location.
/P2B
/CK
/SDA1/SDI1
/SDI2
/P2A
TTL = TTL compatible input
HV = High Voltage
(1,3)
(1,2)
Name
(2)
/RX
(1,2)
/SDO1
(1)
/SDO1
(1)
/P1A
PIC16F/LF1826/27 PINOUT DESCRIPTION (CONTINUED)
/DT
(1)
(1,3)
(1,3)
(1)
(1)
(1)
/INT/
/
/
/
Function
CLKOUT
MDMIN
CPS11
CPS10
CLKIN
OSC2
CLKR
SDO1
OSC1
CCP2
CCP1
SDA1
SDA2
SDO1
AN10
AN11
FLT0
SDI1
SDI2
RA6
P1D
P2B
RA7
P1C
P2A
RB0
T1G
P1A
RB1
RB2
INT
SRI
RX
DT
TX
CK
RX
DT
ST
XTAL = Crystal
CMOS
CMOS
Input
XTAL
I
I
Type
= Schmitt Trigger input with CMOS levels I
2
2
TTL
TTL
TTL
TTL
TTL
ST
ST
ST
ST
ST
ST
AN
AN
ST
ST
AN
AN
ST
ST
ST
ST
—
—
—
—
—
—
—
—
—
C™
—
—
C™
—
Preliminary
Output
CMOS General purpose I/O.
CMOS F
CMOS Clock Reference Output.
CMOS PWM output.
CMOS PWM output.
CMOS SPI data output 1.
CMOS General purpose I/O.
CMOS PWM output.
CMOS Capture/Compare/PWM2.
CMOS PWM output.
CMOS General purpose I/O. Individually controlled interrupt-on-change.
CMOS Capture/Compare/PWM1.
CMOS PWM output.
CMOS General purpose I/O. Individually controlled interrupt-on-change.
CMOS USART synchronous data.
CMOS General purpose I/O. Individually controlled interrupt-on-change.
CMOS Modulator source input.
CMOS USART asynchronous transmit.
CMOS USART synchronous clock.
CMOS USART synchronous data.
CMOS SPI data output 1.
XTAL
Type
OD
OD
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Crystal/Resonator (LP, XT, HS modes).
Crystal/Resonator (LP, XT, HS modes).
External clock input (EC mode).
Individually enabled pull-up.
Timer1 Gate input.
External interrupt.
SR latch input.
ECCP Auto-Shutdown Fault input.
Individually enabled pull-up.
A/D Channel 11 input.
Capacitive sensing input 11.
USART asynchronous input.
I
SPI data input 1.
Individually enabled pull-up.
A/D Channel 10 input.
Capacitive sensing input 10.
USART asynchronous input.
I
SPI data input 2.
2
2
OSC
C™ data input/output 1.
C™ data input/output 2.
/4 output.
Description
OD
2
C™ = Schmitt Trigger input with I
 2010 Microchip Technology Inc.
= Open Drain
levels
2
C