DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 191
DF2505BR26DV
Manufacturer Part Number
DF2505BR26DV
Description
IC H8S/2505 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2505BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2505BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 191 of 980
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On-Chip HCAN Module Access Timing (H8S/2556 Group Only):On-chip HCAN module is
accessed in five states. At this time, the data bus width is 16 bits. Figure 7.12 shows on-chip
HCAN module access timing, and figure 7.13 shows the pin states.
φ
Internal address bus
Read
Write
Figure 7.11 Pin States during On-Chip IEB Module Access
HCAN read signal
Internal data bus
HCAN write signal
Internal data bus
φ
Address bus
AS
RD
HWR, LWR
Data bus
Figure 7.12 On-Chip HCAN Module Access Cycle
T
T
1
1
High impedance
T
T
2
2
Bus cycle
Retained
High
High
High
Bus cycle
Address
T
T
Write data
Rev. 6.00 Sep. 24, 2009 Page 143 of 928
3
3
T
T
4
4
Section 7 Bus Controller
Read data
T
5
REJ09B0099-0600
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