DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 172

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
A setting can be made in bits RCW1 and RCW0 in REFCR to delay RAS signal output by one to
three cycles. Use bits RLW1 and RLW0 in REFCR to adjust the width of the RAS signal. The
settings of bits RCW1, RCW0, RLW1, and RLW0 are valid only in refresh operations.
Figure 6.39 shows the timing when bits RCW1 and RCW0 are set.
Rev. 2.00, 03/04, page 138 of 534
Figure 6.39 CBR Refresh Timing (RCW1 = 0, RCW0 = 1, RLW1 = 0, RLW0 = 0)
φ
(
φ
RTCNT
RTCOR
Refresh request
signal and CMF bit
setting signal
,
φ
)
(
,
)
T
Rp
Figure 6.37 Compare Match Timing
Figure 6.38 CBR Refresh Timing
T
Rp
N
T
Rrw
T
Rr
T
Rr
N
T
Rc1
T
Rc1
H'00
T
Rc2
T
Rc2

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